Heat pipe radiator
A heat dissipation device and heat pipe technology, applied in cooling/ventilation/heating transformation, instrument cooling, instruments, etc., can solve problems such as low temperature, insufficient heat absorption and heat dissipation of the heat sink, and further improvement of the performance of the heat sink. To achieve the effect of performance improvement
Inactive Publication Date: 2009-11-18
FU ZHUN PRECISION IND SHENZHEN +1
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Problems solved by technology
However, usually only a part of the bottom plate, usually the central part of the bottom plate, is in direct contact with the electronic components and absorbs heat, making the central part of the bottom plate overheated, while other areas on the bottom plate are relatively cold
As a result, the heat sink located far away from the central area of the bottom plate cannot fully absorb and dissipate heat, and the performance of the heat sink needs to be further improved
Method used
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Embodiment Construction
[0012] The heat pipe cooling device of the present invention is used for cooling electronic components such as a central processing unit (not shown in the figure).
[0013] see Figure 1 to Figure 3 , is an embodiment of the heat pipe cooling device of the present invention. The heat pipe cooling device includes a bottom plate 10 , a cooling fin set 20 disposed on the bottom plate 10 and two sets of heat pipes 32 , 36 . Two sets of heat pipes 32 , 36 are sandwiched between the bottom plate 10 and the heat sink set 20 .
[0014] Both sets of heat pipes 32 and 36 are bent into a U shape and are flat. Each heat pipe 32 includes two parallel sections with equal lengths and spaced apart from each other, respectively serving as an evaporating section 322 for absorbing heat and a condensing section 324 for releasing heat. Each heat pipe 36 includes two parallel sections with unequal lengths and spaced apart from each other, serving as an evaporating section 362 for absorbing heat ...
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A heat pipe cooling device, comprising a bottom plate and a plurality of cooling fins arranged on the bottom plate, a groove is formed on one surface of the bottom plate, and at least two heat pipes are embedded in the groove, wherein each heat pipe is bent to have a first heat transfer section and a Both ends of the first heat transfer section bend and extend in the same direction as the second heat transfer section, and the second heat transfer sections of the two heat pipes are parallel to each other. The first heat transfer section and the second heat transfer section of the two heat pipes are distributed on the bottom plate, which can quickly and evenly distribute the heat generated by the electronic components to the entire bottom plate. There is a big improvement.
Description
【Technical field】 [0001] The invention relates to a heat dissipation device, in particular to a heat pipe heat dissipation device for cooling electronic components. 【Background technique】 [0002] Electronic components (such as central processing unit) generate a lot of heat during operation, which increases the temperature of itself and the system, which in turn leads to a decrease in its operating performance. In order to ensure the normal operation of electronic components, heat sinks are usually installed on the electronic components to dissipate the large amount of heat generated by them. [0003] A traditional heat sink generally includes a base plate in contact with electronic components and a plurality of cooling fins arranged on the base plate. The heat generated by the operation of the electronic components is absorbed by the bottom plate, and then dissipated to the surrounding environment through the heat sink to cool the electronic components. However, usually ...
Claims
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IPC IPC(8): H05K7/20G12B15/00H01L23/36G06F1/20
Inventor 夏万林李涛校敏奇
Owner FU ZHUN PRECISION IND SHENZHEN