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Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium

A technology for cleaning devices and substrates, applied to chemical instruments and methods, cleaning methods and tools, cleaning methods using tools, etc., can solve problems such as damage to the periphery of wafers, and achieve the effect of compact developing devices

Active Publication Date: 2010-01-13
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the substrate cleaning apparatus described in Patent Document 1, the peripheral portion of the wafer is held on the hollow cylinder using a mechanical chuck or the like, and therefore the peripheral portion of the wafer may be damaged.

Method used

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  • Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium
  • Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium
  • Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium

Examples

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Embodiment Construction

[0100] In the embodiments described below, a cleaning device of a type provided on a coating and developing device as an example of a substrate cleaning device (hereinafter referred to as a cleaning device) will be described. A specific example of the photolithography process including the cleaning process of this cleaning device will be described later, but this cleaning device is installed near the exit of the coating and developing device, for example, to clean the back surface of the wafer on which the resist film is formed. After cleaning, the wafer is transported to the subsequent exposure equipment.

[0101] Initially, referring to Figure 1 ~ Figure 3 The structure of the cleaning device according to this embodiment will be described. figure 1 To show a perspective view of the cleaning device 1, figure 2 To represent its plan view, image 3 is a longitudinal section view.

[0102] Such as figure 1 As shown, the cleaning device 1 is a suction pad 2 as a first sub...

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PUM

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Abstract

Disclosed is a substrate cleaning apparatus for cleaning a back surface of a substrate without damaging the periphery of the substrate or reversing the substrate. The substrate supporting apparatus (1) comprises two substrate supporting units (an absorbent pad (2), a revolving chuck (3)) for supporting the substrate with the back surface facing down from the back, the supporting areas are not overlapped, and substrates are overlapped between the substrate supporting units. A cleaning part (a brush (5)) cleans the back of the substrate except the area supported by the substrate supporting units, and cleans the whole back of the substrate by using the overlapped substrate between the two substrate supporting units.

Description

technical field [0001] The present invention relates to a technique for cleaning the back surface of a so-called substrate such as a semiconductor wafer or a glass substrate (LCD substrate) for a liquid crystal display. Background technique [0002] In the manufacturing process of semiconductor devices, it is extremely important to keep, for example, a semiconductor wafer (hereinafter referred to as wafer) in a clean state. Therefore, before and after various manufacturing processes or treatment processes, a process for cleaning the surface of the wafer is provided as necessary. [0003] A general method of cleaning a wafer surface is to push a brush from above onto a wafer fixed on, for example, a vacuum chuck or a mechanical chuck, and supply deionized water (Deionized Water: hereinafter referred to as DIW) or the like to the brush and the wafer. The wafers slide relative to each other, thereby removing particles from the surface. [0004] It is necessary to perform such...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/02B08B7/04
CPCB08B1/04B08B7/0057H01L21/0209H01L21/67046H01L21/67051
Inventor 泷口靖史山本太郎藤本昭浩锦户修一熊谷大吉高直人北野高广德永容一
Owner TOKYO ELECTRON LTD