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Temperature tuning the wavelength of a semiconductor laser using a variable thermal impedance

A laser and semiconductor technology, applied in semiconductor lasers, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as low efficiency and inability to adjust temperature efficiency, and achieve the effect of low power

Inactive Publication Date: 2011-05-11
C8 MEDISENSORS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, further temperature adjustments cannot be made later through thermal impedance changes and this method relies on the aforementioned cooling or heating schemes (resulting in inefficiency) to achieve the required temperature adjustments during device operation

Method used

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  • Temperature tuning the wavelength of a semiconductor laser using a variable thermal impedance
  • Temperature tuning the wavelength of a semiconductor laser using a variable thermal impedance
  • Temperature tuning the wavelength of a semiconductor laser using a variable thermal impedance

Examples

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Embodiment Construction

[0022] Figure 1 is a diagram of a device in which adjustable thermal impedance is achieved by intermittent contact between different components of a heat sink. In this example, the heat sink is built in two parts—which will be referred to as laser heat sink 110 and second heat sink 120 . The semiconductor laser 150 is in contact with the laser heat sink 110, but is thermally insulated from the housing 160 so that the heat flow is mainly through the heat sink. The heat sink 110 may be thermally coupled to the second heat sink 120 by means of an actuator 170 for driving the two components together. In one design, the actuator 170 is a solenoid.

[0023] While FIG. 1 shows a situation where the laser heat sink 110 is offset onto the second heat sink 120 when the actuator 170 is extended, in an alternative approach the position of the laser heat sink 110 is fixed and the actuation The tool 170 is used to move the second heat sink 120 to the contact position.

[0024] In one des...

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PUM

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Abstract

An apparatus is described in which the temperature of a semiconductor laser (or other device) can be set to a desired value by using the heat generated by the laser itself in conjunction with an adjustable thermal impedance heat sink to effect the desired temperature rise.

Description

[0001] Related Application Cross Reference [0002] This application is claimed under 35 U.S.C. §119(e) based on an application filed by Jan Lipson on May 14, 2004 and entitled "Apparatus to temperature tune the wavelength of a semiconductor laser using variable thermal impedance" of a semiconductor laser using a variable thermal impedance)" U.S. Provisional Patent Application No. 60 / 570,562. technical field [0003] The present invention generally relates to device temperature control primarily by passive mechanisms, such as can be used to tune the wavelength of a semiconductor laser by changing the temperature of the semiconductor laser. Background technique [0004] The wavelength of semiconductor lasers has been tuned by controlled temperature changes. Two common components used to change temperature are thermoelectric coolers and resistive heaters. Thermoelectric coolers typically use the Peltier effect. Depending on the direction of current flow through the Peltier ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S3/13
CPCH01L2924/0002H01L2924/00H01L23/36H01S5/024
Inventor 简·利普森
Owner C8 MEDISENSORS