Method and device for encapsulating electronic components with a conditioning gas

A technology of electronic components and packaging devices, which is applied in the field of packaging electronic components, can solve the problems of unusable mold parts, product loss, and the process of adhesion growth cannot be completely predicted and understood, and achieve the effect of preventing cooling
CN101018658AActive Publication Date: 2007-08-15BESI NETHERLANDS BV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
BESI NETHERLANDS BV
Publication Date
2007-08-15

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Abstract

The invention relates to a method for encapsulating electronic components in a mould (2, 3) by the processing steps of: A) placing the electronic component (12) for encapsulating in a mould cavity (4), and B) feeding an encapsulating material (5) to the mould cavity (4), wherein at least a part of the mould surface (8) defining the mould cavity (4) is brought into contact with a conditioning gas containing a decreased oxygen concentration relative to the atmosphere. The device also relates to a device for encapsulating an electronic component (12), in particular a semiconductor, with encapsulating material.
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Description

technical field

[0001] The invention relates to a method for encapsulating electronic components in a mold according to the preamble of claim 1 . The invention also relates to a device for encapsulating an electronic component, in particular a semiconductor, with an encapsulating material according to the preamble of claim 12 . Background technique

[0002] The packaging of electronic components, such as especially semiconductor circuits, is used extensively. The electronic component is here typically mounted on a carrier ("leadframe", "board") which is clamped between the parts of the mold so that it surrounds the The electronic components on the carrier form a mold cavity. An important consideration here is that the mold must maintain limited adhesion to the encapsulation material in order to prevent damage to the packaged product and contamination of the mold during processing of the encapsulation material. To limit the degree of adhesion between the encapsulation mate...

Claims

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