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Ceramic foam electronic component cooling

A technology of electronic components and ceramic foam, which is applied in the field of electronic component cooling devices and can solve problems such as operating temperature limitations

Inactive Publication Date: 2012-05-23
THE BOEING CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

while still limiting the operating temperature to around 160°F

Method used

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  • Ceramic foam electronic component cooling
  • Ceramic foam electronic component cooling
  • Ceramic foam electronic component cooling

Examples

Experimental program
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Effect test

Embodiment Construction

[0024] By way of overview and with reference to figure 1 , an exemplary apparatus 10 for cooling electronic components 12 includes a foam member 18 whose outer surfaces are encapsulated by an adhesive sealant forming housing 14 . The inlet 16 penetrates the housing 14 so that coolant can be introduced into the foam part 18 . The electronic component 12 includes a housing 20 that forms an outer surface of the electronic component 12 . The shape of the foam piece 18 corresponds to the shape of the casing 20 so that the foam piece 18 on the casing 20 and the casing 20 finally exchange heat with the electronic component 12 . Foam member 18 has a pore size of no greater than about 50 microns and a void content of at least about 80%. The foam piece 18 is encapsulated within the housing 14 such that the coolant is contained within the foam piece 18 and is able to flow through the foam piece 18 . Exemplary embodiments and applications thereof will be specifically described below. ...

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Abstract

In an exemplary apparatus for cooling an electronic component, a housing defines an inlet port and an exhaust port and a foam member is disposed within the housing. The foam member has a shape that conforms to a shape of at least one surface of an electronic component such that the foam member is receivable thereon in thermal communication. The foam member has a pore size of no more than around 50 micrometers and a porosity of at least around 80 percent. The foam member is arranged within the housing such that coolant is flowable through the foam member. Pore size may be around 35 micrometersand porosity may be around 90 percent. Foam may be a ceramic foam that includes silica, aluminum oxide, and aluminum borosilicate fibers. In an application, at least one exemplary apparatus may be received in thermal communication on an upper case of an electronic chip.

Description

technical field [0001] The invention relates to an electronic component cooling device. Background technique [0002] Integrated circuit chips, such as microprocessor chips, and other electronic components generate heat during operation. These components are usually mounted on printed circuit boards (PCBs). To help ensure proper operation, these components are generally kept below an operating temperature of approximately 160°F. This means that some form of cooling must be provided for the correct operation of the electronic components. [0003] For example, cold plates are widely used in cooling PCBs, where the coolant must be kept separate from electronic components, such as those used in avionics on aircraft. Avionics cooling on aircraft is accomplished by blowing cold conditioned air over cold plate heat sinks attached to the back of PCBs (ie, the side away from the chip upper case). Cold plates typically include enhanced heat transfer surfaces enclosed in high aspec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/473
CPCF28F13/003H01L23/467H01L23/3733H01L2924/0002H01L2924/00H01L23/36H05K7/20009
Inventor 威廉·W·贝伦斯安德鲁·R·塔克
Owner THE BOEING CO