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Method of making a diaphragm of a condenser microphone element

A technology for condenser microphones and components, which is applied in the field of producing diaphragms of condenser microphone components, and can solve the problems of low yield and uniformity, consumption, high cost and time, etc.

Inactive Publication Date: 2011-11-30
中国台湾格雷蒙股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the plastic diaphragm produced by stamping not only has a low yield and uniformity, but also the traditional method of assembling the diaphragm with spacers after the completion of the condenser microphone element is more costly and time consuming.

Method used

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  • Method of making a diaphragm of a condenser microphone element
  • Method of making a diaphragm of a condenser microphone element
  • Method of making a diaphragm of a condenser microphone element

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Embodiment Construction

[0014] Please refer to Figure 1 to Figure 9 . Figure 1 to Figure 9 Schematic illustration of a method of fabricating a diaphragm for a condenser microphone element in accordance with a preferred embodiment of the present invention. Such as figure 1 As shown, first, a substrate 10, such as a semiconductor wafer, is provided. Subsequently, a dielectric layer 12 is formed on the first surface of the substrate 10 , wherein silicon oxide is selected as the material of the dielectric layer 12 in this embodiment, and its thickness is about 4 microns.

[0015] Such as figure 2 As shown, a silicon layer 14 is then formed on the surface of the dielectric layer 12, wherein polysilicon formed by deposition is selected as the material of the silicon layer 14 in this embodiment, and its thickness is about 10 microns, and the stress value of the silicon layer 14 is controlled at the dielectric Below about 10 MPa, but the method of the present invention is not limited thereto. Materials...

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Abstract

A base is provided, and a dielectric layer is formed on a first surface of the base. Then a plurality of silicon spacers are formed on the surface of the dielectric layer. Then a diaphragm layer is formed on the surface of the silicon spacer and the dielectric layer. Then a flat layer is formed on the diaphragm layer, and a second surface of the base is etched to form a plurality of openings corresponding to the diaphragm layer on the surface of the dielectric layer. Finally, the dielectric layer exposed by the opening is removed, and then the planar layer is removed.

Description

technical field [0001] The invention relates to a method for manufacturing a diaphragm of a capacitive microphone element, in particular to a method for manufacturing a diaphragm of a capacitive microphone element with a silicon spacer. Background technique [0002] The condenser microphone element includes a parallel capacitor formed by the diaphragm and the back plate. When the diaphragm vibrates under sound pressure, the capacitance between the diaphragm and the back will change, thereby converting the sound signal into a voltage signal. Generally speaking, condenser microphone elements are mainly divided into two types: electret (electret) and condensation (condenser). For condenser microphone elements, since the diaphragm is used to sense sound pressure, the It must have good uniformity, so that it can sensitively and accurately reflect the sound size and vibration frequency. [0003] The diaphragms of conventional condenser microphone elements are mostly made of plast...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/00H04R19/04H04R31/00
Inventor 何宪龙
Owner 中国台湾格雷蒙股份有限公司