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Hinge concealed micro electromechanical device

A technology of micro-electromechanical devices and electrodes, which is applied in the field of forming integrated devices such as semiconductor devices, and can solve problems such as hinge elasticity, mirrors that cannot be completely flat, and mirror heights that are different

Inactive Publication Date: 2008-01-09
MICRONIC LASER SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, using reflectors made of aluminum has some disadvantages such as: mirrors may not be perfectly flat; mirror heights may vary between mirrors; mirrors may buckle when tilted; mirrors may sag when tilted; mirrors may have predeflection different from each other; hinges may have anelastic behavior

Method used

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Embodiment Construction

[0017] For the purposes of this application, the terms "wafer" and "substrate" are used interchangeably, differing only in their dimensions.

[0018] The method according to the invention is particularly suitable for producing micromirror spatial light modulators. However, it can be applied to various microelectromechanical devices, thermal detectors and non-thermal detector devices such as quantum well detectors, pyroelectric detectors, bolometers, etc., but not limited thereto. The invention is particularly applicable when a structure (eg micromirror array) cannot be directly processed / patterned / deposited on a substrate with another structure (eg steering electronics). This is the case, for example, if the structures provided on said substrate are sensitive to the process temperature of the processing of the structures to be provided thereon, or when the substrate is polycrystalline and the components grown on the substrate must be monocrystalline.

[0019] Fig. 1 schematic...

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Abstract

The invention provides a micro electromechanical device making method, comprising: removing material from a substrate to define at least a hidden support in the substrate; pasting at least a hidden support onto a chip including at least an actuation electrode, which can actuate at least a part of the substrate and the rotating axis of the substrate is basically vertical to the hidden support.

Description

technical field [0001] The present invention generally relates to a technique of forming an integrated device such as a semiconductor device, and in particular to a method of manufacturing a micromirror with hidden hinges and a spatial light modulator including such a micromirror. Background technique [0002] It is known in the state of the art to manufacture spatial light modulators (SLMs) of the micromirror type of US Patent 4566935, US Patent 4710732, and US Patent 4956619. Two main principles for fabricating integrated devices such as micromirrors SLMs are generally employed. [0003] An integrated circuit (IC) is fabricated in a finished state, and micromirrors are then fabricated on said IC. The micromirror is built on an IC wafer. The advantage of this method is that so-called IC foundries can be used, which stands for very efficient wafer manufacturing of electronic devices. The disadvantage is that the choice of materials and methods that can be used to fabricat...

Claims

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Application Information

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IPC IPC(8): G02B26/08
Inventor 彼得·伊诺克森马丁·布林格
Owner MICRONIC LASER SYST
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