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Direct-write lithography apparatus with focusing mechanism

A lithography and optical technology, applied in the field of lithography, can solve the problems of long exposure time of a single wafer, difficult operation of single-pixel continuous scanning lithography, slow processing speed, etc. Real-time alignment detection and real-time correction

Inactive Publication Date: 2011-12-07
芯硕半导体(合肥)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the laser beam direct writing method is point-by-point exposure, using high-energy laser to directly generate graphics on the light-sensitive substrate, the processing speed is slow, and the exposure time of a single wafer is long; the second method uses a computer-controlled pattern generator (SLM) to generate area One-time exposure to the corresponding giant domain on the light-sensitive substrate, the main problem is that the resolution is low, and it is limited by the shape of the unit pixel and the effective fill-in factor. Difficulty making continuous smooth graphic outlines
[0008] In order to solve the problem of low efficiency of the existing step-by-step direct-write lithography technology and the difficulty of continuous scanning lithography operation of a single pixel, Chinese patent application 200720037805.9 discloses a comprehensive direct-write lithography device

Method used

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  • Direct-write lithography apparatus with focusing mechanism
  • Direct-write lithography apparatus with focusing mechanism
  • Direct-write lithography apparatus with focusing mechanism

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] see figure 1 , a direct writing lithography device with a focusing mechanism includes:

[0025] The two focused light sources 1A and 1B for providing illumination light beams, the focused light source 1A and the light source 1B are preferably light emitting diodes, arc lamps, or lasers.

[0026] Two focusing optical collectors 2A for providing the illuminating beam, an optical collecting system 2B, figure 1 What is shown in is a single optical device, and those skilled in the art should understand that a combination of multiple optical devices can also be applied. The same understanding applies to all optics shown in the pictures.

[0027] A focusing optical wavelength beam splitter 15 coaxially superimposes the two beams of light according to the corresponding wavelengths of the focusing light source 1A and the light source 1B. The focusing optical wavelength beam splitter 15 is at an angle of 30 degrees relative to the programmable pattern generator 3, and the adju...

Embodiment 2

[0044] see figure 2 , the device is a modification of Embodiment 1, and the optical path is changed by exchanging the positions of the optical wavelength beam splitter 6 and the mirror 14, so that the lens of the projection imaging system, or the lens group 4 and the projection lens 5 are coaxial, and the optical The detection lens 13, photosensitive detector 8 and projection lens 5 of the positioning detection system are parallel non-coaxial structures. Those skilled in the art should understand that it is also possible to apply and add different optical device combinations such as mirrors and beam splitters, change the optical path positions of the projection imaging system and the optical positioning detection system, and achieve the focusing function of this embodiment in the same way.

[0045] The focusing light source 1A is a laser, and the focusing optical collector 2A and the focusing optical wavelength beam splitter 15 are the same as those in the first embodiment. ...

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Abstract

The invention relates to the field of lithography technology, and solves the problem that the off-axis focusing of the optical positioning detection system and the exposure projection system in the direct writing lithography device requires displacement correction for different lenses. The feature is: a focusing system is added between the optical collector and the programmable pattern generator; the focusing optical wavelength beam splitter is located between the optical collector and the programmable pattern generator, and the focusing optical collector and the focusing The light source is in turn positioned above the focusing optical wavelength beam splitter. Directly use the projection lens with variable magnification to project the focus pattern coaxially, realize the coaxial focusing of different lenses, avoid the separate displacement correction process required by off-axis focusing for different lenses, improve efficiency, and reduce the number of off-axis focusing devices the cost of. The real-time correction of the focal plane change caused by the conversion process of the projection lens is realized, and the real-time alignment detection of the existing graphics on the wafer is realized.

Description

technical field [0001] The present invention relates to the technical field of lithography, in particular to a direct-write lithography device for printing patterns on substrates such as wafers, printed circuit boards, mask plates, flat panel displays, biological wafers, micromechanical electronic wafers, and optical glass flat plates . Background technique [0002] Photolithography is used to print a pattern of features on the surface of a substrate. Such substrates may include substrates used in the fabrication of semiconductor devices, various integrated circuits, flat panel displays (eg, liquid crystal displays), circuit boards, biochips, micromechanical electronic chips, optoelectronic circuit chips, and the like. Frequently used substrates are semiconductor wafers or glass substrates. [0003] During lithography, a wafer is placed on a wafer stage, and a pattern of features is projected onto the wafer surface by an exposure device within the lithography apparatus. A...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20H01L21/027
Inventor 刘文海
Owner 芯硕半导体(合肥)有限公司