Encapsulation structure of lead rack base ball grid array and its wafer carrier

Abstract

The utility model relates to a wire frame substrate BGA (ball grid array) package structure and the wafer carrier, which mainly comprises a wire frame which has a plurality of reconfigured pins integrated connecting with inner pins and ball pads, a slotted stiffening piece stuck on the top surface of the wire to the reconfigured pins and the ball pads to prevent the reconfigured pins from moving, a wafer arranged on the wire frame and electrically connected with the inner pins by a plurality of welding wires, and a molding encapsulated colloid which encloses the inner pin, the reconfigured pins, the wafer and the bonding wire. A plurality of conducting spheres are arranged on the ball pads. The utility model has the advantages that reducing the cost of the wafer carrier, preventing the reconfigured pins and the ball pads from moving when being encapsulated, and improving the supporting strength to the balls embedded.

Description

technical field [0001] The present invention relates to a ball grid array packaging structure (Ball Grid Array, BGA package) and its chip carrier, in particular to a redistribution lead (redistribution lead) and a ball pad (ball pad) that can prevent a lead frame (Leadframe) ) Lead frame base ball grid array package structure and its chip carrier (LEADFRAME-BASE BALL GRID ARRAYPACKAGE AND CHIP CARRIER FOR THE PACKAGE) displaced during molding (molding). Background technique [0002] In the conventional ball grid array package structure, multiple arrays of ball-shaped external terminals are arranged on the lower surface of a circuit substrate, but the cost of using a printed circuit board as a chip carrier is higher than that of a lead frame and its moisture resistance is poorer. [0003] US Pat. No. 5,847,455 discloses a leadframe-based ball grid array package structure, that is, a leadframe is used as a chip carrier of a ball grid array (BGA) package. Please refer to FIG. ...

AI Technical Summary

Problems solved by technology

Because in the packaging process, each pin 112 is set independently to connect and support the corresponding internal contact fingers 111 and ball pads 113, so these pins 112 are not bent and thinned to a certain extent, and cannot Reach the purpose of reconfiguring these ball pads 113

Since these ball pads 113 are limited by the design of the lead frame itself and are concentrated in a certain area (as shown in FIG. 2 ), they cannot be diffused into an array arrangement with a large interval, which leads to the configuration of these solder balls 150 Quite crowded and prone to bridging short circuits

In addition, during the molding process of the semiconductor, the formation of the molding compound 140 will easily cause the displacement of the ball pads 113, resulting in a short circuit of the pins.

[0005] It can be seen that the above-mentioned existing lead frame base ball grid array package structure obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general products do not have a suitable structure to solve the above-mentioned problems. This is obviously related. The problem that the industry is eager to solve

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