Probe substrate for test and manufacturing method thereof

Abstract

A probe substrate includes a plurality of beams, a probe having a contactor formed at one end of the beam, and a support substrate supporting the probe and having a bending space in which the probe can be bent upwards and downwards, and a trench oxide layer is formed on the upper surface of the support substrate. Therefore, the probe substrate and a manufacturing method thereof according to the present invention forms a trench oxide layer on the boundary of the beam and the support substrate to prevent the boundary from being damaged by stress applied to the boundary during a continuous and repeated bending process of the beam. Therefore, electrical insulation between the beam and the support substrate is maintained to prevent electrical leakage.

Description

technical field [0001] The present invention relates to a probe substrate for testing and a manufacturing method thereof, in particular to a probe substrate including probes for electrically testing whether there is an abnormality in a semiconductor integrated circuit device formed on a semiconductor wafer, and a manufacturing method thereof . Background technique [0002] Generally, integrated circuit devices are manufactured through a series of semiconductor manufacturing processes, and genuine and defective products are screened through electrical testing during the manufacturing process or after the manufacturing is completed. This electrical testing process uses testing equipment that transmits various electrical signals from the outside, and detects and analyzes response signals of semiconductor integrated circuits. In order to electrically connect the test equipment and the semiconductor integrated circuit, it is necessary to use probes. After the manufacturing proc...

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Problems solved by technology

Therefore, bad substrates will be produced, which will reduce the test quality of probe substrates

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