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Grinding pad sander

A technology of grinder and grinding pad, which is applied to the parts of grinding machine tools, grinding/polishing equipment, abrasive surface adjustment devices, etc. Probability of good products and effect of reducing losses

Inactive Publication Date: 2008-06-18
SHANGHAI HUA HONG NEC ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The grinding pad grinder on the existing equipment does not monitor its up and down movement and rotation. If the up and down movement and rotation of the grinding pad grinder are abnormal, the equipment will not stop and give an alarm, which will lead to abnormal and uniform residual film of the processed products. Sexual deterioration, causing great losses

Method used

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  • Grinding pad sander

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Embodiment Construction

[0009] As shown in the figure, in the grinding pad grinder of the present invention, the grinding pad grinder grinding head is fixed on the grinding pad grinder arm 20 through its fixing part 30, and the grinding pad grinder grinding disc 10 is located below the grinding pad grinder grinding head.

[0010] A through hole 110 is provided in the grinding head of the grinding pad grinder, and the position sensor 70 is arranged in the through hole 110 perpendicular to the grinding disc 10 of the grinding pad grinder through the fixing member 80 . The position sensor 70 is a reflective sensor, and the detection distance of the position sensor is 15 mm. Also, the detection distance of the position sensor 70 is 15 mm. The grinding disc 10 is 10 cm away from the detecting head of the position sensor 70 when the upper dead position is in the upper dead position, and 30 cm away from the detecting head of the position sensor 70 when in the lower dead position. The head of the position s...

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PUM

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Abstract

The invention discloses a grinding machine of a grinding pad, which comprises an arm, a grinding head and a grinding disk of the grinding machine of the grinding pad. A position sensor is arranged in the grinding head of the grinding machine of the grinding pad; a relay is arranged between the position sensor and a main machine; the position sensor is used for testing the distance between the grinding disk and the position sensor, when the tested distance is smaller than the set value, the main machine stops working and sends alarm. An occluding sheet is arranged on the grinding head of the grinding machine of the grinding pad; a shading sensor is connected with the main machine, is used for testing that the rotary movement of the grinding head is abnormal so that the main machine stops working and sends alarm. The up and down movement and rotary movement of the grinding disk can be judged whether normal through the position sensor and the shading sensor being added, when the movement is abnormal, the main machine stops working and sends alarm. The invention can stop working and make alarm when the equipment is in abnormal, so that the lost caused by the abnormality of the equipment can be reduced, the yield of the production is increased, the production cost is lowered and the production efficiency is increased.

Description

technical field [0001] The invention relates to the field of integrated circuit production and manufacturing, in particular to a grinding pad polisher in the field of integrated circuit production and manufacturing. Background technique [0002] The abrasive pad polisher is a tool for polishing the abrasive pad in the chemical mechanical polishing process. Grinding discs, grinding pads Grinding discs have up and down motions and rotating motions. The polishing disc of the polishing pad grinder touches the mask pad and leaves the mask pad by moving up and down. When the polishing disc of the polishing pad grinder moves downward and contacts the mask pad, the polishing disc of the polishing pad grinder rotates to polish the mask. pad. The up-and-down and rotating actions of the mask pad polisher determine the quality of the mask pad it polishes and the yield of the product. [0003] With the continuous development of integrated circuits, the requirements of semiconductor de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B53/12
Inventor 瞿治军
Owner SHANGHAI HUA HONG NEC ELECTRONICS