A device comprising a sensor module

Abstract

A device (1) comprising a sensor module (2) with a package (3) is produced at reduced costs by providing the package (3) with two or more substrates (4,5) each with a functional layer (14,15), at least one sensor (24,25) such as a magnetometer and / or an accelerometer being located in at least one functional layer (14,15), and by providing the package (3) with a system comprising solder bumps (7-12) for aligning the functional layers (14,15). The system either comprises a first number of solder bumps (7,8) for coupling the functional layers (14,15) electrically and mechanically to each other via first bonding elements (31) or comprises a third substrate (6) with a third functional layer (16) and a second number of solder bumps (9,10) for coupling the first and third functional layers (14,16) electrically and mechanically to each other via second bonding elements (32) and a third number of solder bumps (11,12) for coupling the second and third functional layers (15,16) electrically and mechanically to each other via third bonding elements (33). Mechanically and / or electrically dummy solder bumps improve the alignment of the functional layers (14,15).

Description

technical field [0001] The invention relates to a device comprising a sensor module, and also to a sensor module and a method of manufacturing the sensor module and the device. Background technique [0002] Examples of such devices are portable computers and small handheld electronic devices such as mobile phones, personal digital assistants, digital cameras and global positioning systems, and electronic devices such as aircraft, automobiles, motorboats, scooters, etc. Large transport equipment such as , mopeds and bicycles. Examples of such sensor modules are sensor modules for measuring magnetic, electric and gravitational fields. [0003] A prior art device is known as US 6,836,971 B1 which discloses a system with a sensor module comprising a first sensor (tilt sensor) and a second sensor (magnetic sensor). [0004] According to a first option, the first and the second sensor are produced separately from each other. In addition, a first substrate having a first functio...

AI Technical Summary

Problems solved by technology

Because of the larger functional area required, the alternative approach of using back-end processing (i.e. CMOS back-end integration) is another expensive option due to the fact that larger original substrate area is required

This difficult and complex process and the large original substrate area with large functional area make such existing devices relatively expensive during fabrication

[0006] The known device is disadvantageous, in particular due to the fact that it is relatively expensive

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