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Resin composition

A technology of resin composition and epoxy resin, applied in the direction of coating, etc., can solve the problems of softness and low warpage

Inactive Publication Date: 2008-07-23
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Although the above-mentioned patents partially disclose ways to change the surface properties of the substrate, they cannot simultaneously have sufficient flexib

Method used

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Abstract

The invention discloses a resin compound to improve the surface energy of a substrate, which makes the surface of the substrate be printed or coated with slurry or ink of different materials easily. The resin compound comprises that: (1) one or more than one reactive epoxy acryl oligomer; (2) methyl acryl or acryl monomer with more than one functtonal, wherein at least one is hydrophilic monomer; (3) at least two or more than two mixtures of photoinitiator; (4) an organic solvent with the boiling point from 40 to 110 centigrade; and appropriate epoxy resin and flexibility agent to adjust pliability. The thin layer with proper surface energy via coating technique has the advantages of enough pliability, heat-resistance, solvent-resistance, low shrinkage, and low warpage.

Description

technical field [0001] The present invention relates to a resin composition, especially to a resin composition whose surface energy can be adjusted by changing the content ratio. Background technique [0002] With the vigorous development of the economy, the demand for all kinds of inks is increasing day by day, and the demand for environmental protection and energy saving has gradually shifted from traditional solvent-based inks to UV-curable inks and environmentally friendly water-based inks. Therefore, the requirements for the surface properties of the substrate are becoming increasingly stringent, such as hardness, surface energy, ink absorption, flatness, roughness, adhesion, scratch resistance, abrasion resistance, chemical resistance and heat resistance, etc. . In addition, with the development of the people's livelihood and chemical industry, in order to cater to various demands for digitalization, personalization and refinement, various basic Material materials ha...

Claims

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Application Information

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IPC IPC(8): C08J7/06C08F220/32
Inventor 刘淑芬金进兴陈碧义洪金贤
Owner IND TECH RES INST
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