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Semiconductor device and method of manufacturing the same

A manufacturing method and semiconductor technology, which are applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., to achieve the effect of improving the qualification rate and reducing the number of manufacturing processes

Inactive Publication Date: 2008-08-27
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the external dimensions and shapes of semiconductor elements are different for each type, it is necessary to prepare lead frames separately for conventional semiconductor devices.

Method used

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  • Semiconductor device and method of manufacturing the same
  • Semiconductor device and method of manufacturing the same
  • Semiconductor device and method of manufacturing the same

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Embodiment Construction

[0037] Hereinafter, a semiconductor device and a manufacturing method thereof according to an embodiment of the present invention will be described with reference to the drawings.

[0038] Here, a multi-chip module (resin-molded semiconductor device) is described as an example in which a plurality of semiconductor elements are arranged on the same surface, and one module is resin-sealed to realize multi-chip multi-chip.

[0039] Fig. 7 is a perspective view showing an example of the structure of a resin-molded semiconductor device according to an embodiment of the present invention. In the drawings, the sealing resin is not shown in order to show the structure of the resin-molded semiconductor device.

[0040] In FIG. 7 , 41 is a flat bare chip base (semiconductor element mounting portion) of the lead frame, 42 is a lead end of the lead frame, 43 is a suspension lead that is a part of the lead end, and 44 is a current that needs to flow to the bare chip base 41. 45 is a contr...

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PUM

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Abstract

The present invention discloses a semiconductor device and manufacture method thereof, variations in fastening positions of semiconductor elements are eliminated by forming protrusions on a die pad so as to enclose the semiconductor elements before an adhesive that fastens the semiconductor elements to the die pad is wetted and spread.

Description

technical field [0001] The present invention relates to a semiconductor device in which a plurality of semiconductor elements are arranged on the same surface and is intended to be multi-chip, and a method of manufacturing the same. Background technique [0002] In recent years, in order to realize the low cost and miniaturization of semiconductor devices, a multi-chip module in which a plurality of semiconductor elements with different functions are mounted on the same surface or a plurality of semiconductor elements formed by different processes has been proposed. . [0003] As a conventional multi-chip module, there is a structure in which a plurality of semiconductor elements are bonded to a flat die pad of a lead frame with an adhesive for bonding, and wirebonding is used to connect a plurality of semiconductor elements. Each semiconductor element is electrically connected to the inner lead part of the lead frame, and between the semiconductor elements. [0004] Howev...

Claims

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Application Information

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IPC IPC(8): H01L25/00H01L21/58
CPCH01L2224/26152H01L2924/01082H01L2924/01322
Inventor 藤原诚司
Owner PANASONIC CORP
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