Self-identifying stacked die semiconductor components

Abstract

A semiconductor die having a functional circuit (e.g., a memory array) and a decode circuit suitable for use in a stacked die semiconductor component (e.g., a random access memory component) is described. The decode circuit permits individual die in a stacked die structure to automatically determine their location or position in the stack and, in response to this determination, selectively pass one or more external control signals (e.g., chip select and clock enable signals) to the decode circuit's associated functional circuit based on inter-die connection patterns. This ''self-configuring'' capability permits all die designated for a specified functionality (e.g., a memory module including four vertically aligned die) to be uniformly or consistently manufactured. This, in turn, can reduce the cost to manufacture stacked die components.

Description

technical field [0001] The present invention relates generally to semiconductor devices, and more particularly to stacked die semiconductor devices, and to methods for uniquely identifying individual die within a stacked die structure. Background technique [0002] Semiconductor devices are typically constructed from silicon or gallium arsenide wafers through a fabrication process involving many deposition, masking, diffusion, etching and implantation steps. Each fabrication flow produces a wafer in which many identical integrated circuit ("IC") devices are formed. After fabrication, the wafer is divided into individual cells, or dies, where each die contains one IC device. Traditionally, individual dies are encapsulated in a molding and electrically connected to leads protruding from the molding. More recently, multiple grains have been arranged in a single inclusion. In one such arrangement, two or more dies are vertically aligned and electrically interconnected to form...

AI Technical Summary

Problems solved by technology

In addition to the increased cost of handling die in this manner, die that are different from each other must be separated and uniquely tracked via a manufacturing part tracking system, further increasing the cost of conventional stacked die devices

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