Circuit board and method of processing the same

Abstract

The invention relates to a circuit board and a processing method thereof. The circuit board of the invention comprises a base plate which is provided with through holes. A metallic conducting coating is arranged on the wall of the through hole and the through holes on two surfaces of the base plate have hole diameters of different sizes. The processing method of the circuit plate is that: the through holes with stepped appearance are formed on the base plate by the use of a drill and the metallic conducting coating is formed on the wall of the through holes with stepped appearance by the use of electroplating techniques. By adopting the structure of the circuit board of the invention, when the metallic conducting coating is formed on the hole wall, the exchange flow between the plating solution in the through holes and the plating solution outside the through holes can be processed so as to ensure the quality and the performance of the metallic conducting coating on the hole wall; theparts with major diameter of the through holes can meet the requirements of the installation of electric elements or the line connection among various levels of the printed circuits of the base platewhile the parts with minor diameters of the through holes occupy less area of the openings on the circuit plate, thereby being convenient for wiring design on the surface of the base plate and providing convenience for installing more electric elements on the base plate.

Description

technical field [0001] The invention relates to a circuit board, more specifically, to a circuit board with a small surface area occupied by through holes and a processing method for the circuit board. Background technique [0002] With the increase of device installation density, the available area of ​​circuit boards on electronic products (the area where components are laid out) is getting smaller and smaller, especially in the local area of ​​circuit boards, the space for device installation is too tight. More components are laid out, and smaller device packages and finer circuits are often used. There are usually many holes arranged on the circuit board, and metal conductive coatings are plated on the walls of the holes. There are two main functions of these holes, one is to install electronic components and accommodate the pins of the components, and the other is to connect the printed circuits on different printed layers of the circuit board. In the prior art, the h...

AI Technical Summary

Problems solved by technology

If it is a blind hole, since the hole does not penetrate the circuit board, the hole will not occupy the area on both sides of the circuit board, which can improve the availability of the circuit board, but the blind hole manufacturing process will double the length of the circuit board The manufacturing process increases, the manufacturing complexity increases, the cost will increase greatly, and the yield and reliability of the circuit board will also decrease; if through holes are used, although the problem of hole wall plating performance can be solved, the through holes are located on both sides of the circuit board. Both occupy a large area, which reduces the usable area of ​​the circuit board and makes it difficult to densely install components on the circuit board

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