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Test base, test base mask and forming method of test base

A technology of mask patterns and substrates, which is applied in the field of integrated circuit manufacturing, can solve problems such as different degrees of unevenness in grinding, differences in grinding, and the inability to detect the influence of peripheral pattern density on grinding uniformity, so as to achieve the effect of improving authenticity

Inactive Publication Date: 2008-10-22
SEMICON MFG INT (SHANGHAI) CORP +1
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Problems solved by technology

[0005] However, in actual production, any product is in a semiconductor substrate with different local pattern densities. Considering the influence of the peripheral pattern density, when performing chemical mechanical polishing operations, it is easy to cause uneven grinding between the center area and the boundary area of ​​the product, that is, grinding difference; and corresponding to different peripheral pattern densities, the unevenness of grinding is also different
However, in the existing test matrix, the pattern density in the peripheral pattern of each test unit is determined, that is, after the chemical mechanical polishing operation is carried out, the unevenness of the product center area and the boundary area is determined.
That is, the influence of peripheral pattern density on grinding uniformity cannot be detected by using the test matrix, in other words, the manufacturing effect of the product cannot be truly simulated by the test matrix

Method used

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  • Test base, test base mask and forming method of test base
  • Test base, test base mask and forming method of test base
  • Test base, test base mask and forming method of test base

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Embodiment Construction

[0037] Although the invention will be described in more detail below with reference to the accompanying drawings, in which preferred embodiments of the invention are shown, it should be understood that those skilled in the art can modify the invention described herein and still achieve the advantageous effects of the invention. Therefore, the following description should be understood as a broad instruction for those skilled in the art, rather than as a limitation of the present invention.

[0038] In the interest of clarity, not all features of an actual implementation are described. In the following description, well-known functions and constructions are not described in detail since they would obscure the invention with unnecessary detail. It should be appreciated that in the development of any actual embodiment, numerous implementation details must be worked out to achieve the developer's specific goals, such as changing from one embodiment to another in accordance with sy...

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Abstract

The invention relates to a test substrate, which comprises at least one set of test units which are used for replacing products to detect the manufacturing effect, wherein, each test unit comprises at least two test primitives and at least two auxiliary test primitives; the test primitives are connected with the auxiliary test primitives at intervals; and peripheral figures are arranged outside the test units and filling figures are arranged inside the peripheral figures. Moreover, the invention also provides a test substrate mask and a method for forming the test substrate. The test substrate can realize detection of the grinding uniformity affected by the density of the peripheral figures of the products and improve the authenticity of the detection.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, in particular to a test base, a test base mask and a method for forming the test base. Background technique [0002] In the traditional integrated circuit manufacturing process, in order to ensure the quality of the product, inspection is required after many steps involved in the manufacturing process, such as inspection of products after grinding or etching. Usually, a test matrix is ​​fabricated on a semiconductor substrate, and then the test matrix is ​​used instead of the product for testing. In order to enable the test base to truly simulate the relevant manufacturing process of the product, the test base and the product are produced synchronously. [0003] Various attempts have been made in the industry regarding the structure of the test base and how to use the test base to perform process inspection and then complete the manufacture of semiconductor devices. The...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/544H01L21/00G03F1/14G03F1/44
Inventor 胡宇慧邓永平
Owner SEMICON MFG INT (SHANGHAI) CORP
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