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Electromagnetic wave-absorption multilayer substrate

A radio wave absorption, multi-layer substrate technology, applied in electrical components, layered products, magnetic field/electric field shielding, etc., can solve problems such as the reduction of radio wave absorption rate and radio wave absorption rate, and achieve the effect of preventing the decline of radio wave absorption rate

Inactive Publication Date: 2011-07-27
ALPS ALPINE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, as shown in FIG. 19 and FIG. 20 , when insulating substrates 105A and 105B are thermocompression bonded to radio wave absorbing sheet 102 to form radio wave absorbing multilayer substrate 101 , radio wave absorbing sheet 102 will be softened due to the influence of thermocompression bonding. The bonding material 104 will make the radio wave absorbing sheet 102 compress
Since the imaginary magnetic permeability μ" of the radio wave absorbing sheet 102 using the metallic glass alloy has the property that the flat particle-shaped metallic glass alloy is compressed, the lower the radio wave absorptivity of the formed radio wave absorbing multilayer substrate 101 is. The problem that the radio wave absorption rate of the radio wave absorbing sheet 102 is further reduced

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  • Electromagnetic wave-absorption multilayer substrate

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Embodiment Construction

[0051] Next, use Figure 1 to Figure 14 , the radio wave absorbing multilayer substrate of the present invention will be described based on the first and second embodiments.

[0052] Figure 1 to Figure 3 A radio wave absorbing multilayer substrate 1A of the first embodiment is shown. The radio wave absorbing multilayer substrate 1A of the first embodiment is, for example, figure 1 As shown, it includes a radio wave absorbing sheet 2 and two insulating substrates 5A, 5B.

[0053] Such as Figure 9 As shown, the mixture containing the soft magnetic alloy powder 3 and the bonding material 4 is flaked by the doctor blade method, or flaked by the coating method of spraying the soft magnetic alloy powder 3 on the bonding material 4, and is flaked by hot pressing. The radio wave absorbing sheet 2 is received. In order to increase the density of the soft magnetic alloy powder 3 and to repair surface defects and internal voids of the radio wave absorbing sheet 2 to improve the ra...

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Abstract

An electromagnetic wave-absorption multilayer substrate has an electromagnetic wave-absorption sheet which includes a soft magnetic alloy powder and a binding agent and two insulating substrates which have facing surfaces facing the electromagnetic wave-absorption sheet and which are pressure-bonded thereto. In addition, one of the insulating substrates has a plurality of holes formed in the facing surface.

Description

technical field [0001] The present invention relates to a radio wave absorbing multilayer substrate, and more particularly to a radio wave absorbing multilayer substrate capable of properly utilizing electronic circuits used in electronic equipment such as mobile phones and AV equipment that require noise cancellation. Background technique [0002] In general, in high-frequency electronic equipment such as mobile phones and wireless equipment, in order to suppress the leakage of high-frequency noise generated by electronic circuits such as flexible wiring boards and ICs, and to avoid leakage from external circuits outside the high-frequency electronic equipment The high-frequency noise of the high-frequency electronic equipment is mixed into the electronic circuit of the high-frequency electronic device, and the electric wave absorbing multilayer substrate is pasted on the electronic circuit. [0003] As shown in FIG. 17 , a conventional radio wave absorbing multilayer subst...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00
CPCB32B7/02Y10T428/32Y10T428/325Y10T428/24612H05K9/0081
Inventor 石垣功小村英夫
Owner ALPS ALPINE CO LTD