Luminous diode encapsulation method with high efficiency light emitting effect and its packaging structure

A technology of light-emitting diodes and luminous effects, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid-state devices, etc., which can solve problems such as inconvenience, poor light efficiency and loss of light rods, and achieve the effect of shortening the process time

Active Publication Date: 2008-11-26
HARVATEK CORPORATION
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, because the excited area of ​​the stripped package colloid is not uniform, the light efficiency of the light bar is not good (that is, the area of ​​the stripped package colloid close to the LED chip will generate a stronger excitation light source, while The encapsu

Method used

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  • Luminous diode encapsulation method with high efficiency light emitting effect and its packaging structure
  • Luminous diode encapsulation method with high efficiency light emitting effect and its packaging structure
  • Luminous diode encapsulation method with high efficiency light emitting effect and its packaging structure

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Example Embodiment

[0063] See image 3 , image 3 a to image 3 d, and image 3 A to image 3 Shown in D. image 3 Is a flowchart of the first embodiment of the packaging method of the present invention, image 3 a to image 3 d is respectively a schematic diagram of the packaging process of the first embodiment of the packaging structure of the present invention, image 3 A to image 3 D is a schematic cross-sectional view of the packaging process of the first embodiment of the packaging structure of the present invention. by image 3 It can be seen from the flowchart that the first embodiment of the present invention provides a method for packaging a light-emitting diode with a high-efficiency light-emitting effect, which includes the following steps:

[0064] First, please cooperate image 3 a and image 3 As shown in A, a substrate unit 1 is provided, which has a substrate body 10, and a plurality of positive electrode traces 11 and a plurality of negative electrodes respectively formed on the s...

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Abstract

The invention discloses a light-emitting diode packaging structure, which comprises a substrate unit, a light-emitting unit and a package colloid unit. The substrate unit is provided with a substrate body, a positive electrode trace and a negative electrode trace, wherein the positive electrode trace and the negative electrode trace are respectively arranged on the substrate body. The light-emitting unit is provided with a plurality of LED chips on the substrate body, wherein each LED chip is provided with a positive electrode side and a negative electrode side which are respectively and electrically connected with the positive electrode trace and the negative electrode trace. The package colloid unit is provided with a plurality of package colloids which are respectively coated on the LED chips.

Description

technical field [0001] The invention relates to a packaging method and a packaging structure of a light-emitting diode chip, in particular to a packaging method and a packaging structure of a light-emitting diode with high-efficiency luminous effects. Background technique [0002] see figure 1 As shown, it is a flow chart of the first packaging method of conventional light emitting diodes. As can be seen from the flow chart, the first packaging method of conventional light-emitting diodes includes the following steps: firstly, providing a plurality of packaged light-emitting diodes (packaged LEDs) (S800); then, providing a stripped substrate body ), on which there is a positive electrode trace (positive electrode trace) and a negative electrode trace (negative electrode trace) (S802); finally, each packaged light-emitting diode (packaged LED) is sequentially arranged on the strip substrate body and electrically connect the positive and negative terminals of each packaged L...

Claims

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Application Information

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IPC IPC(8): H01L21/50H01L21/56H01L21/60H01L25/00H01L25/075H01L23/488H01L23/28
CPCH01L24/97H01L2224/48091H01L2924/12041H01L2924/15747H01L2924/15787
Inventor 汪秉龙庄峰辉吴文逵
Owner HARVATEK CORPORATION
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