Luminous diode encapsulation method with high efficiency light emitting effect and its packaging structure

Abstract

The invention discloses a light-emitting diode packaging structure, which comprises a substrate unit, a light-emitting unit and a package colloid unit. The substrate unit is provided with a substrate body, a positive electrode trace and a negative electrode trace, wherein the positive electrode trace and the negative electrode trace are respectively arranged on the substrate body. The light-emitting unit is provided with a plurality of LED chips on the substrate body, wherein each LED chip is provided with a positive electrode side and a negative electrode side which are respectively and electrically connected with the positive electrode trace and the negative electrode trace. The package colloid unit is provided with a plurality of package colloids which are respectively coated on the LED chips.

Description

technical field [0001] The invention relates to a packaging method and a packaging structure of a light-emitting diode chip, in particular to a packaging method and a packaging structure of a light-emitting diode with high-efficiency luminous effects. Background technique [0002] see figure 1 As shown, it is a flow chart of the first packaging method of conventional light emitting diodes. As can be seen from the flow chart, the first packaging method of conventional light-emitting diodes includes the following steps: firstly, providing a plurality of packaged light-emitting diodes (packaged LEDs) (S800); then, providing a stripped substrate body ), on which there is a positive electrode trace (positive electrode trace) and a negative electrode trace (negative electrode trace) (S802); finally, each packaged light-emitting diode (packaged LED) is sequentially arranged on the strip substrate body and electrically connect the positive and negative terminals of each packaged L...

AI Technical Summary

Problems solved by technology

However, because the excited area of ​​the stripped package colloid is not uniform, the light efficiency of the light bar is not good (that is, the area of ​​the stripped package colloid close to the LED chip will generate a stronger excitation light source, while The encapsulant area away from the LED chip produces a weaker excitation light source)

[0006] From the above, it can be seen that the currently known packaging methods and packaging structures of light-emitting diodes obviously have inconveniences and deficiencies, and need to be improved.

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