Power transport mechanism and plasma auxiliary chemical vapor deposition apparatus using the same

Abstract

The invention discloses a power transmission mechanism, which combines airtight and flexible components with a power unit to generate displacement motion in a given direction. Besides, this invention further provides a plasma-assisted chemical vapor deposition device which makes use of the power transmission mechanism as a mechanism for controlling the movement of a component to be processed so that the plasma-assisted chemical vapor deposition device can be combined with an automatic transmission device so that the in and out of a chip are automated. In addition, the plasma-assisted chemicalvapor deposition device is further provided with a lifting and adjusting unit and a position marking unit to allow an operator to adjust the space between an upper electrode and a lower electrode according to the requirements of a manufacture process and the operator of the machine station to clearly control the space between the upper electrode and the lower electrode inside the cavity body fromthe outside of the cavity body.

Description

technical field [0001] The present invention relates to a power transmission mechanism, in particular to a power transmission mechanism that combines an airtight and telescopic component with a power unit to generate a displacement movement in a specific direction, and uses the power transmission As a mechanism to control the movement of the chip up and down, the mechanism can automate the transfer and placement of the chip, thereby improving the quality and productivity of a plasma-assisted chemical vapor deposition device. Background technique [0002] IC semiconductor and solar photoelectric products have been closely related to people's daily life. However, the equipment used to produce these products today, such as plasma-enhanced chemical vapor deposition (Plasma-Enhanced Chemical Vapor Deposition, PECVD), is still monopolized by several large foreign manufacturers. At the same time, the machines produced by these large manufacturers are too expensive on the one hand,...

AI Technical Summary

Problems solved by technology

However, picking and placing chips manually not only limits the overall production efficiency, but also easily reduces the pass rate due to contamination of the chips

[0005] Recently, there are also those who use robotic arms for automatic pick-and-place, but not only the floor space required for the machine is large, but also the cost is high

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