Unlock instant, AI-driven research and patent intelligence for your innovation.

Device and method for treating the surfaces of substrates

A technology for surface treatment and substrate, which is applied to the device for coating liquid on the surface, thin material treatment, transportation and packaging, etc. It can solve the problem of not being guaranteed, and achieve the effect of compact structure and space saving.

Active Publication Date: 2008-12-24
GEBR SCHMID GMBH & CO
View PDF1 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This cannot be guaranteed with known devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device and method for treating the surfaces of substrates
  • Device and method for treating the surfaces of substrates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] The device 1 for surface treatment of substrates 2 shown in FIGS. 1 and 2 has a plurality of transport mechanisms designed as transport rollers 3 , 3 a. The transport rollers 3, 3a are provided and adjusted for the linear transport of the substrate 2, in particular made of silicon material. The transport rollers 3 , 3 a define a transport plane 5 , which is oriented in the horizontal direction and which is tangential to the transport rollers 3 , 3 a at the surface. The transport rollers 3 , 3 a are mounted rotatably in the device 1 and are at least partially driven at a preferably constant, adjustable rotational speed by a drive (not shown).

[0032] The substrate 2 is typically a flat, planar silicon plate having a circular profile with a diameter of from about 60 mm to 250 mm or a rectangular profile with side lengths from 60 mm to 250 mm. The preferred thickness of the substrate lies in the range of 0.1 mm to 2 mm. The substrate 2 lies with the substrate surface 4 ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a device for treating the surfaces of silicon wafers, comprising transport rollers for transporting the silicon wafer, and at least one conveyor device which wets the surface of the silicon wafer with an aqueous medium on a transport plane which is determined by the transport rollers. The conveyor device is configured such that it can apply the process medium to the surface of the silicon wafer, which is oriented in a downward manner and which is arranged on the transport plane. Several suction pipes for suctioning gaseous and / or mist-like distributed process mediums from the area surrounding the conveyor device are provided. The suction pipes are arranged in the vertical direction below the transport plane.

Description

technical field [0001] The invention relates to a device for surface treatment of substrates, which has at least one transport mechanism for transporting substrates, in particular made of silicon material, and at least one device for treating substrates in liquid, gaseous or spray form The conveying mechanism in which the processing medium wets the surface of the substrate in the conveying plane determined by the conveying mechanism. The invention likewise relates to a method for wetting a substrate surface of a substrate, in particular made of silicon material, with a treatment medium. Background technique [0002] DE 102 25 848 A1 discloses a device and a method for removing a coating from the upper side of a planar substrate. Here, the solvent is sprayed obliquely onto the substrate from above with nozzles. The substrate is placed on and transported by a transport wave. At least one lateral end of the substrate protrudes from the conveying wave, so that the solvent con...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00B05C1/08
CPCH01L21/67017H01L21/67023H01L21/67075H01L21/6708H01L21/67706H01L21/67721H01L21/6776H01L21/6838Y10S414/141
Inventor H·卡普勒
Owner GEBR SCHMID GMBH & CO