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Thermal interface material, its preparation method and packaging body with the same

A thermal interface material, packaging technology, applied in heat exchange materials, chemical instruments and methods, thin material processing and other directions, can solve the problems of chemical inactivity, affecting the thermal conductivity of carbon nanotube composite materials, etc.

Active Publication Date: 2010-05-26
TSINGHUA UNIV +1
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0004] However, since most of the carbon atom bonds on the surface of carbon nanotubes are in a saturated state and the chemical properties are inactive, there is a phenomenon of mutual non-wetting between carbon nanotubes and most metals, which will lead to the formation of carbon nanotubes and metals. The combination is relatively fragile, which will affect the thermal conductivity of carbon nanotube composites

Method used

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  • Thermal interface material, its preparation method and packaging body with the same
  • Thermal interface material, its preparation method and packaging body with the same
  • Thermal interface material, its preparation method and packaging body with the same

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Embodiment Construction

[0017] The thermal interface material of the technical solution, its preparation method and the package with the thermal interface material will be described in detail below with reference to the accompanying drawings and embodiments.

[0018] Such as figure 1 As shown, the first embodiment of the technical solution provides a thermal interface material 100 , which includes a carbon nanotube array 110 , a heat dissipation matrix 120 and a wetting film 130 . The carbon nanotube array 110 is formed by a plurality of carbon nanotubes 111 arranged in an array. In the carbon nanotube array 110 , there are gaps between adjacent carbon nanotubes 111 , and the heat dissipation matrix 120 fills the gaps in the carbon nanotube array 110 . The wetting film 130 is formed between the surface of each carbon nanotube 111 and the heat dissipation matrix 120 .

[0019] The wetting film 130 can be a single-layer wetting film, and the material of the single-layer wetting film can be selected f...

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Abstract

The invention relates to a thermal interface material which comprises a carbon nanometer tube array and heat radiating matrix spread in the spaces among the carbon nanometer tube array. An infiltration film exists between each carbon nanometer tube surface and the heat radiating matrix. In addition, the invention further relates to a preparation method for heat interface material and a packaging body with the heat interface material.

Description

technical field [0001] The invention relates to a heat dissipation medium, in particular to a thermal interface material and a preparation method thereof, and a packaging body with the thermal interface material. Background technique [0002] With the vigorous development of the microelectronics industry, the main frequency of electronic chips is getting higher and higher, and the line width is getting narrower and narrower, resulting in more and more heat generated by the chip. Therefore, the problem of heat dissipation has gradually become a major obstacle to the performance of the chip. The study found that the thermal resistance of the interface between the cooling element and the chip and between the cooling elements is an important factor restricting the cooling efficiency of the cooling module. At present, thermal interface materials are usually used to reduce the interface thermal resistance, so as to improve the heat dissipation efficiency of the heat dissipation el...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/373C09K5/14
CPCH01L23/373H01L23/433H01L2924/0002Y10T428/24132H01L2924/00
Inventor 姚湲姜开利
Owner TSINGHUA UNIV