Light emitting device and method of manufacturing the same
A technology of light-emitting devices and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., and can solve the problems of light-emitting device output drop, extraction efficiency drop, and time-consuming, etc.
Active Publication Date: 2010-06-02
NICHIA CORP
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- Description
- Claims
- Application Information
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Problems solved by technology
As a result, the extraction efficiency of light to the outside of the light emitting device decreases.
Furthermore, when the body color of the protective element absorbs the light from the light-emitting element, the enclosed light is absorbed by the protective element, so the output of the light-emitting device drops significantly
In addition, it is impractical to block the intrusion of light into the recess by burying the recess for accommodating the protection element with a light-reflective filler because of labor and material costs.
Method used
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[0035] The light-emitting device has a protective element disposed on the bottom surface of the concave portion lower than the mounting surface of the light-emitting element, and further has a cavity in the concave portion in which the protective element is accommodated. Here, a difference in refractive index occurs between the translucent member covering the light emitting element and the cavity. Then, light radiated from the light emitting element or light from the phosphor is reflected to the outside of the light emitting device at these boundary surfaces having different refractive indices. That is, the present invention can improve the light extraction efficiency of the light-emitting device by using the cavity provided in the concave portion, compared with the prior art. In addition, these lights are extracted from the light emitting device without being lost in the concave portion, so that the variation in light distribution and chromaticity of the light emitting device...
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A light emitting device and manufacturing method thereof, wherein the light emitting device 100 includes a light emitting element 101, a package for arranging the light emitting element 101, and an electrically conductive wire 106 for connecting an electrode disposed on the package and an electrode of the light emitting element. The package includes a support member 108 having a mounting portion to arrange the light emitting element 101 and defining a recess 103 to house a semiconductor element 102 which is different than the light emitting element, and a light transmissive member 107 coveringat least the light emitting element 101. The package defines a hollow portion 111 between the light transmissive member 107 covering the opening of the recess 103 and an inner wall defining the recess 103.
Description
technical field [0001] The present invention relates to a light-emitting device used for lighting fixtures, displays, backlights of mobile phones, auxiliary light sources for animation lighting, other light sources, etc., and a manufacturing method thereof. Background technique [0002] A light-emitting device using a light-emitting element such as a light-emitting diode emits brightly colored light with a small size and excellent power efficiency. In addition, such a light-emitting element is different from a light bulb and the like, and there is no need to worry about the bulb being broken. In addition, it is characterized by excellent initial drive characteristics, resistance to vibrations, and repeated operations of switching lamps on and off. Due to such excellent characteristics, light-emitting devices using light-emitting elements such as light-emitting diodes (LEDs) and laser diodes (LDs) are used as light sources such as lighting fixtures and backlights of mobile p...
Claims
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IPC IPC(8): H01L25/00H01L25/16H01L23/31H01L21/50H01L21/56H01L33/62H01L33/32H01L33/50H01L33/56H01L33/58
CPCH01L2224/48091H01L2224/48465H01L2924/01322H01L2924/3025
Inventor 乃一拓也
Owner NICHIA CORP