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Multilayer wiring board and its manufacturing method

A technology for multilayer wiring substrates and wiring substrates, applied in the direction of multi-layer circuit manufacturing, etc., can solve the problems of deterioration of electrical connectivity, inability to contact wiring materials and conductors, etc., and achieve the effect of stabilizing electrical connectivity

Inactive Publication Date: 2011-03-30
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, there is a problem that firm contact cannot be achieved between the wiring material and the conductor, thereby deteriorating the electrical connection between the conductor and the wiring material

Method used

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  • Multilayer wiring board and its manufacturing method
  • Multilayer wiring board and its manufacturing method
  • Multilayer wiring board and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0130] figure 1 It is a cross-sectional view showing the structure of the multilayer wiring board according to the first embodiment of the present invention.

[0131] In the multilayer wiring board, conductors 4 and 9 are formed in the through holes 3 provided in the first electrically insulating base material 1 and the second electrically insulating base material 7, and the wiring between layers can be carried out at any position. The electrical connection, so the wiring can be stored at a high density.

[0132] This multilayer wiring board has a structure in which a second electrically insulating base material 7 is laminated by heating and pressing on both surfaces of a double-sided wiring board 6 as a core layer, and laminated. The double-sided wiring board 6 has a structure in which first wirings 10 are formed on the front and back surfaces of the first electrically insulating base material 1. The through holes 3 formed in the second electrically insulating base material 7 ar...

no. 2 approach

[0171] Secondly, refer to Figure 5A~Figure 5I The manufacturing steps of the multilayer wiring board of the present invention will be described.

[0172] In addition, the parts already described in the conventional example and the first embodiment will be briefly described. In addition, the definition of terms in the following description is also the same as in the first embodiment.

[0173] First, like Figure 5A As shown, the protective film 2 is pasted on the surface and the back surface of the electrically insulating base material 1.

[0174] Here, as the material of the electrically insulating base material 1, a composite base material of fibers and resin impregnated can be used. For example, as the fiber, a woven or non-woven fabric such as glass fiber, aramid fiber, fluorine-containing fiber, liquid crystal polymer, etc. can be used. In addition, as the impregnating resin, epoxy resin, polyimide resin, PPE resin, PPO resin, phenol resin, etc. can be used.

[0175] Among them...

no. 3 approach

[0219] Next, refer to Figure 6A~Figure 6G The other manufacturing steps of the multilayer wiring board of the present invention will be described. In addition, the parts that overlap with the already explained examples will be briefly explained. In addition, the definition of terms in the following description is also the same as that of the first embodiment or the second embodiment.

[0220] First, like Figure 6A As shown, a conductor 17 is formed on the surface of the wiring material 5.

[0221] Here, as the wiring material 5, a metal foil can be used, and copper foil with a roughened surface is particularly preferably used.

[0222] As the conductor 17, as in the example in the first embodiment, a conductive paste formed of conductive particles and thermosetting resin is used. Here, since the conductor 17 is formed in a state protruding on the wiring material 5, the screen printing method, which is a simple manufacturing method, is used.

[0223] Furthermore, in order to suffic...

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PUM

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Abstract

A multilayer wiring board comprises first and second wirings provided on both sides of an electric insulating base, a conductor extending through the electric insulating base to interconnect the first and second wirings and an anchoring conductor extending through the electric insulating base. The presence of the anchoring conductor prevents strain in the shearing direction in the electrical insulating base and deformation of the conductor. Thus, a multilayer wiring board excellent in electrical connection is provided.

Description

Technical field [0001] The present invention relates to a multilayer wiring substrate that electrically connects multilayer wiring through internal via holes (inner via holes) and a manufacturing method thereof. Background technique [0002] In recent years, with the miniaturization and higher performance of electronic equipment, it is not limited to industrial equipment, but in the broad field of consumer equipment, there is also a strong demand for low-cost supply of multilayer wiring substrates that can mount semiconductor chips such as LSI in high density. . In such a multilayer wiring board, it is important to electrically connect multilayer wiring patterns formed with fine wiring pitches with high connection reliability. [0003] The inter-layer connection of the existing multilayer wiring board is mainly realized by the metal-plated conductor formed on the inner wall of the through hole. However, in response to the above market requirements, it has attracted attention that ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
Inventor 东谷秀树
Owner PANASONIC CORP