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Method and device for stirring solder paste

The technology of a stirring device and a stirring method is applied in the directions of mixing methods, chemical instruments and methods, dissolution, etc., and can solve the problems such as quality monitoring of solderless paste stirring, labor and time consumption, and difficult solder paste stirring time.

Inactive Publication Date: 2009-05-27
INVENTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the length of solder paste stirring time is usually determined by the experience of the user, and it varies from person to person. There is no standardized quality control of solder paste stirring. Paste, measure its viscosity, use it if it meets the standard value, if it does not meet the standard value, re-stir other solder paste cans until it meets the standard value
Therefore, the traditional method of judging the solder paste mixing time by trial and error not only consumes manpower and time, but also makes it difficult to obtain the optimal solder paste mixing time.

Method used

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  • Method and device for stirring solder paste
  • Method and device for stirring solder paste
  • Method and device for stirring solder paste

Examples

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Embodiment Construction

[0032] figure 1 It is a block diagram of a solder paste stirring device in an embodiment of the present invention, figure 2 It is a flowchart of a solder paste stirring method in an embodiment of the present invention. Please refer to figure 1 , The solder paste mixing device 200 of the present invention includes a mixer body 210 , an input unit 220 , a computing unit 230 , a storage unit 240 and a display module 250 . The mixer body 210 is used to stir the solder paste, wherein the mixer body 210 may have a stirring container and a motor driving the stirring container, and the solder paste is placed in the stirring container for stirring. The display module 250 is, for example, a liquid crystal display, which and the input unit 220 are all configured on the blender body 210, and the display module 250 is electrically connected to the storage unit 240 and the input unit 220, and the computing unit 230 is electrically connected to the input unit 220 and the storage unit 240....

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Abstract

The invention discloses a tin cream stirring method suitable for leading the consistency of the tin cream to achieve a standard value. The steps thereof comprise: (a) a first tin cream is stirred at a first time and the consistency of the first tin cream after being stirred is obtained; (b) a second time is calculated according to the first time and the consistency of the first tin cream; (c) a second tin cream is stirred at a second time and the consistency of the second tin cream after being stirred is obtained; and (d) the consistency of the second tin cream is judged whether to meet the standard value or not; if no, then the second time is adjusted according to the consistency of the second tin cream and then step c and step d are carried out once again; if yes, the N tin cream is stirred according to the second time; wherein, N is larger than the signless integral of 2.

Description

technical field [0001] The present invention relates to a solder paste stirring method and a solder paste stirring device, and in particular to a solder paste stirring method and a solder paste stirring device which automatically calculate the stirring time. Background technique [0002] The solder paste used in the surface-mount technology must be stirred before use so that the flux and the solder powder are evenly mixed to obtain a better solder paste. Good welding effect. The traditional method of judging whether the solder paste has been evenly mixed is based on the viscosity of the solder paste. If the viscosity is too high or too low, the soldering quality between the component and the carrier will be poor. [0003] The traditional method of stirring solder paste is to fix the speed of the solder paste mixer and input a predetermined stirring time to stir the unevenly mixed flux and tin crystal powder in the solder paste mixer into a uniformly mixed solder paste. The...

Claims

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Application Information

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IPC IPC(8): B01F3/14B23K3/00B01F23/57
Inventor 曹惠国陈瑾慧黄东豪
Owner INVENTEC CORP