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Radiating device

A technology of heat dissipation device and heat pipe, which is applied in cooling/ventilation/heating transformation, electrical components, electric solid devices, etc., can solve the problems of long heat conduction path and affect the heat dissipation efficiency of the heat dissipation device, and achieve the effect of improving the heat dissipation efficiency

Active Publication Date: 2012-05-23
CHAMP TECH OPTICAL FOSHAN
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Problems solved by technology

However, since the groove of this method is opened on the base plate, the thickness of the base plate must be greater than the inner diameter of the groove
Therefore, the bottom plate used in this method needs to be thicker, resulting in a longer heat conduction path from the electronic components to the fins, which affects the heat dissipation efficiency of the heat sink

Method used

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Examples

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Embodiment Construction

[0015] Such as Figures 1 to 3 As shown, the heat sink 10 of the preferred embodiment of the present invention is used to dissipate heat from electronic components (not shown) mounted on a circuit board (not shown), and includes a bottom plate 20, a top plate 30 coupled to the bottom plate 20 1. A lower fin set 50 and an upper fin set 40 respectively connected to the bottom plate 20 and the top plate 30 and a plurality of flat heat pipes 60 sandwiched between the bottom plate 20 and the top plate 30 .

[0016] Please also refer to Figure 4 , the bottom plate 20 is integrally formed by a metal plate, and its longitudinal section is roughly "U"-shaped. The bottom plate 20 includes a flat rectangular body 22 , two sidewalls 24 vertically upwardly extending from two opposite sides of the body 22 , and two sidewalls 26 horizontally and oppositely formed from tops of the two sidewalls 24 . A part of the plate body 22 punches out a square boss 220 (such as Figure 4 ) and the rec...

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Abstract

The invention relates to a heat radiator used for heat dissipation of electronic components, comprising a base plate, a lower fin group which is combined on the base plate and a plurality of heat pipes which are arranged on the base plate. The heat radiator also comprises a top plate which is combined on the base plate and is used for clamping the heat pipes together with the base plate, the heatpipes are bent at least one time and are closely closed to each other from beginning to end. Compared with the prior art, the heat pipes of the heat radiator are clamped between the base plate and the top plate without opening a groove on the base plate. Therefore, the thickness of the base plate can be controlled within a small range, and the heat generated by the electronic components can be ensured to be transmitted to the fins by passing through the shortest heat conducting path, so as to improve the heat dissipation efficiency of the heat radiator correspondingly.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for dissipating heat from electronic components. Background technique [0002] In recent years, with the development of the electronics industry, the performance of electronic components has been continuously improved, and the calculation speed has become faster and faster. The calculation speed of the internal chipset has been continuously improved, the number of chips has continued to increase, and the heat emitted by the chips has also increased accordingly. If If the heat is not dissipated in time, the performance of the electronic components will be greatly affected, and the computing speed of the electronic components will be reduced. As the heat continues to accumulate, the electronic components may be burned, so the electronic components must be dissipated. [0003] A traditional heat sink includes a bottom plate and a plurality of fins extending upwa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/427
Inventor 赖其渊周志勇赖振田
Owner CHAMP TECH OPTICAL FOSHAN
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