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Centering unit

A wafer and clamping cylinder technology, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve problems such as wafer centering failure, wafer collision fragments, etc., and achieve the effect of ensuring accuracy

Active Publication Date: 2009-07-29
SHENYANG KINGSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the above problems, the present invention provides a centering unit, which solves the problems of wafer centering failure and chip fragments occurring when the wafer is returned to the cassette.

Method used

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Embodiment Construction

[0014] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0015] As shown in Fig. 1-2, the present invention is equipped with wafer centering part 2, clamping cylinder limiter 3, vacuum switch valve body 4, vacuum pipeline 5, wafer supporting pillar 6, clamping cylinder 7, clamping Cylinder on-off valve body 8, etc., are provided with three wafer supporting pillars 6 on the bracket 9 carrying the processed wafer 1, and the inside of the wafer supporting pillar 6 is made into a vacuum channel, and the vacuum channel in the wafer supporting pillar 6 passes through The vacuum pipeline 5 is connected to the vacuum switch valve body 4, and the two sides of the wafer supporting pillar 6 are provided with clamping cylinders 7, and the clamping cylinder 7 is controlled on and off by the clamping cylinder on-off valve body 8 connected thereto. The wafer centering part 2 corresponding to the outer edge of the processed ...

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Abstract

The invention relates to a centering unit in semiconductor equipment during the process of wafer conveying. The centering unit is particularly applicable to the centering conveying of wafers with thicker glue films, thus solving the problems such as centering failure of the wafer, the occurrence of hit and crush when the wafer returns to a wafer box and the like. The centering unit is provided with a wafer centering component, a wafer bearing pillar and clamping cylinders. The wafer bearing pillar is arranged on a supporting bracket bearing the wafer to be processed and provided with a vacuum passage communicated with a vacuum line; and two sides of the wafer bearing pillar are provided with the clamping cylinders. The centering unit not only comprises all functions of former centering units, but also is applicable to the centering process of equipment with a relatively thick glue film and thick sealing, thus preventing the center of the wafer from deviation caused by the sticking of glue during the centering process.

Description

Technical field: [0001] The invention relates to a centering unit in the process of wafer transmission in semiconductor equipment, and is especially suitable for the centering transmission of wafers with thick adhesive films. Background technique: [0002] At present, the centering unit of semiconductor equipment is composed of cylinders, wafer brackets, centering guide posts, etc. After the wafer comes out of the cassette, it is centered by the centering unit; then it is transferred to other process units by robots, etc. After the processing is completed, it is centered by the centering unit and returned to the cassette. When the wafer is processed with a relatively thick adhesive film in the process unit, the edge of the wafer often has glue flowing down. When it is passed to the centering unit, when the centering guide pin clamps the wafer and then releases the wafer, due to The stickiness of the glue makes the chip deviate along with the guide post, so that the centerin...

Claims

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Application Information

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IPC IPC(8): H01L21/68
Inventor 徐春旭
Owner SHENYANG KINGSEMI CO LTD
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