Thermoelectric device and method for manufacturing same
A technology of thermoelectric devices and thermoelectric elements, which is applied in the direction of thermoelectric devices that only use the Peltier or Seebeck effect, and can solve the problems of power generation performance degradation
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no. 1 example
[0071] Such as figure 1 As shown, the thermoelectric device (closed container) 1 according to the first embodiment of the present invention is composed of a metal substrate 2 made of metal, a metal substrate placed on the central portion of the surface of the metal substrate 2 (hereinafter referred to as "first main surface α") The thermoelectric element 3, the cover 4 for covering the upper surface and the side surface of the thermoelectric element 3, and the joining metal member 5 made of metal that hermetically seals the metal substrate 2 and the cover 4 on the peripheral portion of the first major surface α constitute. More specifically, all members constituting the container (electrical heating device) 1, namely, the metal substrate 2, the metal cover 4, and the joining metal member 5 are made of metal.
[0072] An insulating layer 6 is provided in the central portion on the first major surface α, and a first conductive wiring layer 7 is formed on the insulating layer 6 ....
no. 2 example
[0125] Next, a second embodiment will be described below. In the second embodiment and each variation of the second embodiment, the same reference numerals are attached to the same components as those explained in the first embodiment, and thus repeated description of the same components will be omitted here.
[0126] Such as Figure 15 As shown in , the thermoelectric device 31 according to the second embodiment of the present invention includes a substrate 32 , a thermoelectric element 3 on the substrate 32 and a cover 34 , and also includes a sprayed layer 35 formed to closely contact the inner surface of the insulating cover 4 .
[0127] The substrate 32 is composed of an insulating substrate 32 a , a metal film 32 b provided on the insulating substrate 32 , and a wiring layer 37 . Here, the surface of the substrate 32 refers to the surface on which the thermoelectric elements are mounted, and the back surface thereof refers to the surface on which the metal film 32b is p...
no. 3 example
[0164] Next, a third embodiment will be described below. In the third embodiment, the same reference numerals are attached to the same components as those explained in the first embodiment, and thus repeated description of the same components will be omitted here.
[0165] Figure 26 is a sectional view of the thermoelectric device 1 according to the third embodiment. The electromotive force generated from the thermoelectric element 3 is extracted to the outside of the thermoelectric device 1 through the via wiring 13 , the metal layer 14 , the solder 15 , and the external electrode 16 . In the third embodiment, the insulating material 18 insulating from the cooling medium is provided on the surface opposite to the surface of the solder 15 connected to the external electrodes 16 .
[0166] In each of the above-described embodiments, in the thermoelectric device 1 etc., the thickness of the metal substrate 2 etc. is reduced in the region of the via wiring 13 to include the ex...
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