Device to coat metallic coating onto wafer
A metal coating, wafer technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as limiting productivity, and achieve the effect of high productivity
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[0024] FIG. 1 shows a device 100 for applying a metal coating to a wafer, not shown in detail. The device 100 has a base 1 which is supported on the ground by means of feet 2 . The feet 2 are adjustable so that the base 1 can be oriented horizontally. Arranged on the base 1 is a base plate 3 for a circular switch disk 4 , which can be rotated by means of a drive 5 in predetermined angular increments.
[0025] Furthermore, a base 6 is arranged on the base, on which a pad printing device 8 supported by an Oldham slide 7 is arranged. With the aid of the cross slide 7, the pad printing unit 8 can be positioned with very high precision. Furthermore, three screen printing devices 9 are arranged on the base 6 , only one of which can be seen in each case in FIGS. 1 and 2 . However, the layout of the three screen printing devices is seen in Figure 3.
[0026] The rotary table 10 is controlled to rotate around the base 6 by the drive device 5 . A plurality of suction pumps 11 are f...
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