6results about How to "Avoid mechanical stress" patented technology

The invention relates to an environment-friendly process method for improving the surface metal cleaning efficiency of a silicon wafer, and belongs to the technical field of semiconductor silicon wafer processing, and the process method comprises the following operation steps: S1, pre-cleaning and activation: placing the silicon wafer in a first cleaning tank, introducing ozone into ultrapure water, and processing in cooperation with low-frequency ultrasound; and S2, main cleaning and complexing: placing the silicon wafer subjected to pre-cleaning and activating treatment in a second cleaning tank, and treating the silicon wafer in a dilute citric acid solution in cooperation with high-frequency ultrasound. And S3, overflow rinsing: placing the silicon wafer subjected to main cleaning and complexing treatment in a third cleaning tank. And S4, drying: carrying out drying treatment on the silicon wafer subjected to the overflow rinsing treatment. Through the synergistic effect of physical stripping, chemical oxidation and complexing dissolution, under the condition that highly toxic chemicals such as hydrofluoric acid are not used, the cleanliness of metal on the surface of the silicon wafer reaches the ppt level, and the problems that traditional RCA cleaning is serious in environmental pollution and high in operation risk are effectively solved.

The utility model discloses a regulating valve support structure for thermal energy source belongs to regulating valve support structure field, including installation bottom plate, the upper surface fixed connection of installation bottom plate has damping mechanism, the middle part of installation bottom plate upper surface is equipped with the A sliding slot of sliding connection support mechanism, the support mechanism is including A slider, the outer surface sliding connection of A slider is in the inside of A sliding slot, the upper surface fixed connection of A slider has A connecting plate, through the cooperation of above -mentioned each device, through the support mechanism of setting, when supporting regulating valve, according to the position and height of regulating valve will support mechanism adaptation adjustment, can accurately place support in the best position, ensure that regulating valve and its connecting pipeline get even and enough support, effectively avoid stress concentration problem, for the pipeline expansion caused by temperature change, adjustable support can provide necessary displacement space, prevent the additional mechanical stress produced thereby.

The invention relates to an online automatic flat film thickness adjusting die head and an adjusting method thereof.The online automatic flat film thickness adjusting die head comprises a front die body and a rear die body, and a melt runner is formed between the front die body and the rear die body; a front lip and a rear lip are respectively arranged at the lower ends of the front mold body and the rear mold body, a lip gap is formed between the front lip and the rear lip, and heating pipes are uniformly inserted in the front mold body and / or the rear mold body at intervals along the width direction of the flat film; by adjusting the temperature of the heating pipe in the corresponding area, the fluidity of the melt in the area is changed, and the thickness of the flat film flowing out of the area corresponding to the lip seam is adjusted. According to the invention, the local heating temperature is independently controlled, and the viscosity and fluidity of the melt in the corresponding area are changed, so that the discharging amount of the lip seam is finely adjusted to adjust the thickness of the flat film. The adjustment mode based on thermal expansion and rheological properties can realize continuous, stepless and trace thickness adjustment, and can effectively cope with production occasions with extremely high requirements on film thickness uniformity.

The application discloses a kind of electrochemical auxiliary ohmic contact wafer resistivity nondestructive testing equipment and nondestructive testing method, the electrochemical auxiliary ohmic contact wafer resistivity nondestructive testing equipment includes: shell, two probes, first electrolyte and integrated control system;The cavity is formed in the shell, the insulating clamp is equipped in the shell, the insulating clamp is used to clamp the sidewall of the wafer to be measured, to fix wafer;Two probes are respectively arranged at the upper and lower ends of wafer;And the probe is spaced apart from wafer, and the probe is formed with flow port;The first electrolyte is located between probe and wafer;The flow port is used to flow the first electrolyte to between probe and wafer;The integrated control system has positive and negative poles, and the positive and negative poles of integrated control system are respectively connected with two probes.The application has the advantages of avoiding damaging wafer while saving process steps, improving detection efficiency.

The invention discloses a method for manually stripping an In column of an 8-inch reading circuit. The method comprises the following steps: putting a low-corrosivity organic solvent into a specially designed quartz soaking tank to remove photoresist; fixing an 8-inch reading circuit chip on a special clamp, holding a clamp handle by hand to vertically place the clamp and the chip into the quartz soaking tank, and enabling the chip to be completely immersed in the stripping liquid; inclining the clamp towards one surface with the reading circuit, wherein the front surface of the reading circuit faces downwards; after soaking for 4 hours, a medical injector is used for sucking stripping liquid to spray and wash the edge of the front surface of the reading circuit on the clamp, so that In on the surface is bulged and is separated from the chip, and tweezers are used for clamping away the bulged In; after stripping is completed, the front face and the back face of the reading circuit are washed; finally, putting the chip into a drying oven, and drying at 100 DEG C for 10 minutes; scratch and deformation of the In column are obviously reduced, and stripping efficiency and yield are improved. Through inclined clamp design and pressure control, In particle falling and mechanical stress are avoided.

The utility model discloses a double -sided marking device, including base, be provided with feeding mechanism and discharging mechanism on the base, be provided with conveying mechanism between feeding mechanism and discharging mechanism, still be provided with adjusting mechanism positioning device and reset mechanism along the conveying direction of conveying mechanism on the base, be provided with marking mechanism between positioning device and reset mechanism, the utility model has the beneficial effect that through feeding and discharging and conveying mechanism, realize full -automatic marking, reduce manual intervention, utilize laser to directly carve on material surface, make the mark have wear -resisting, corrosion -resistant and so on The advantage compares with traditional marking mode and need not ink or chemical reagent, and the mark is not easy to fade or fall off, reduces environmental pollution, meets the environmental protection requirement, and laser marking speed is fast, can promote the marking efficiency, and laser carries out marking, need not direct contact material, can avoid mechanical stress, reduces material deformation or damage.