Die-bonding method for light-emitting diode
A technology of light-emitting diodes and solid crystals, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, circuits, etc., can solve the problems of leakage of plastic materials, difficult to maintain the amount of glue taken, and simplify the process, avoid leakage of plastic materials, Eliminates the effect of light being absorbed
Inactive Publication Date: 2012-05-16
EVERLIGHT ELECTRONICS
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Problems solved by technology
Based on the different polymerization properties of the glue, it is difficult to maintain a certain amount of glue
Furthermore, since the precision of die bonding is about ±50 microns, the leakage of the adhesive material is prone to occur, which in turn may cause the light emitted by the LED to be absorbed by the leaking adhesive material.
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[0019] A detailed description of the manner of making and using the preferred embodiment of the invention is set forth below. The present invention provides an innovative concept and can be widely applied in various professional fields. The preferred embodiments of the present invention are only used to describe each specific method in the manufacture and use of the present invention, but they are not used to limit the present invention. Moreover, in the following content, it is mentioned that a first feature is formed on a second feature, and the embodiments may include: an embodiment in which the first feature and the second feature are formed in direct contact, or in the embodiment An additional feature is inserted between the first feature and the second feature such that the first feature does not directly contact the second feature.
[0020] The various intermediate stages of the manufacturing process of the embodiment of the present invention are described here, and ea...
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Abstract
A die-bonding method for a light-emitting diode (hereinafter referred to as LED) is a die-bonding method for bonding a chip by forming a photoresist layer on an LED chip and filling solder paste, wherein the position and dosage of the filled solder paste can be controlled by the pattern and thickness of the photoresist layer. The die-bonding method comprises the following steps: forming the photoresist layer on one surface of an epitaxial layer of the LED chip and patterning the photoresist layer; filling the solder paste in concave parts of the photoresist layer after patterning; removing the photoresist layer; cutting the LED chip; and finally bonding the chip on a support to finish a die bonding process. The pattern of the photoresist layer is aligned with the pattern of a cutting street on the surface of the epitaxial layer.
Description
technical field [0001] The invention relates to a crystal-bonding method of a light-emitting diode (hereinafter referred to as LED), and in particular to a crystal-bonding method using a photoresist layer to control the position and amount of solder paste. Background technique [0002] The main purpose of LED packaging is to ensure the correct connection and electrical contact between the LED chip and the bracket, and to protect the chip from mechanical, heat, moisture and other external impacts. Therefore, in order to effectively dissipate heat from the LED, the bracket of the LED is mostly made of materials with high thermal conductivity and electrical conductivity, such as metals such as copper and aluminum. At the same time, the adhesive used to fix the chip on the bracket is also mostly made of materials with high thermal conductivity and high electrical conductivity, such as silver glue. [0003] Silver colloidal die bonding is currently the most widely used die bondi...
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IPC IPC(8): H01L33/00H01L21/78
Inventor 郭信男赵自皓陈群鹏
Owner EVERLIGHT ELECTRONICS