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Recyclying faulty multi-die packages

A wafer, qualified technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of no existing technology, etc., and achieve the effect of flexible setting

Inactive Publication Date: 2009-10-07
SANDISK IL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There is currently no prior art describing the use of memory chips partially destroyed during production

Method used

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  • Recyclying faulty multi-die packages
  • Recyclying faulty multi-die packages
  • Recyclying faulty multi-die packages

Examples

Experimental program
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Embodiment Construction

[0051] The present invention is a system and method for reusing a multi-die package containing a reject die. The principles and operation of reusing a multi-die package containing defective dies according to the present invention may be better understood with reference to the drawings and corresponding descriptions.

[0052] figure 1 A simplified schematic diagram of a typical dual die package instance 20 (or DDP instance 20 ) comprising a top die 22 and a bottom die 24 is shown. Such as figure 1 As shown in , DDP example 20 is used to illustrate how a typical prior art DDP is designed. It is clear from this structure that if the top die 22 fails, the performance of the bottom die 24 and thus the entire DDP instance 20 will suffer because the top die 22 remains connected to all package contacts (i.e., VCC 25, CS 26, I / O 27, and GND 28). VCC 25 is a DC voltage source, CS 26 is "chip select" (used to individually select the package of the chip on the bus, and cancel the sele...

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PUM

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Abstract

The present invention teaches the recycling of a faulty multi-die memory package by isolating the functional part of the package and using it as a smaller memory package.

Description

technical field [0001] The present invention relates to systems and methods for recycling multi-die packages containing defective dies. The off-spec multi-die memory package is reused by isolating the functional portion of the package and using it as a smaller memory package. Background technique [0002] Multi-die packaging is well known in the field of digital memory manufacturing. Multi-die packaging is often used when it is not practical to provide the required memory capacity in a single chip due to wafer fabrication constraints. [0003] Because the dice used in multi-die packaging are themselves large, their yields are limited and constrained. Occasionally, bad dies are found during the “wafer sorting” process of testing dies in undiced wafers. However, some bad dies are not detected until after the wafer is diced and the die is assembled. At this stage, valid dies cannot be utilized if adjacent dies fail in the package. This results in significantly lower yields...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/34
CPCH01L2924/0002
Inventor A·梅厄
Owner SANDISK IL
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