X-Y-theta motion platform applied to LED laser cutting equipment

Abstract

The invention relates to an X-Y-theta motion platform applied to LED laser cutting equipment, which comprises an X-Y axis and a theta axis. The X-Y axis and the theta axis have hollow structures, the X-Y axis contains an X-axis transport unit and a Y-axis transport unit, the X-axis transport unit contains an X-axis plate and a linear motor for controlling the motion of the X-axis plate, the Y-axis transport unit contains a Y-axis plate and a linear motor for controlling the motion of the Y-axis plate and is arranged on the X-axis plate of the X-axis transport unit, the Y-axis plate of the Y-axis transport unit is provided with the theta axis, the theta axis comprises a rotating shaft and a motor for controlling the rotation of the rotating shaft, a vacuum absorption module is arranged in the rotating shaft of the theta axis, an absorption plane of the vacuum absorption module is higher than the surface of the rotating shaft of the theta axis, and the X-Y axis is arranged on a base plate. The X-Y-theta motion platform applied to the LED laser cutting equipment realizes the functions of small self inertia, short starting and stopping time, micron-order positioning and second-level angle adjustment of cutting paths, and meets the requirement of volume production of wafer cutting.

Description

technical field [0001] The invention relates to a motion platform, in particular to a wafer cutting X-Y-θ motion platform in LED laser cutting equipment, and belongs to the technical field of laser precision processing equipment. Background technique [0002] LED laser cutting equipment is a special laser equipment used for cutting GaN blue LED wafers on sapphire substrates. Blue LED wafers are usually grown on sapphire substrates by vapor phase deposition process GaN crystals, and finally on the wafers Several LED light-emitting units with independent light-emitting functions are formed by screen printing technology and electrodes. [0003] At present, blue LED wafer cutting equipment has been gradually upgraded from diamond knife cutting to laser cutting. With non-contact laser processing, the equipment must have precise positioning function. Generally, the reserved dicing width of LED wafer is about 20-30um, or even as narrow as 15um, while the laser processing affects t...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the deficiencies in the prior art and provide an X-Y-θ motion platform suitable for LED wafer laser cutting equipment, which aims to effectively solve the large inertia of the platform itself and the start and stop time when cutting blue LED wafers Long, inaccurate positioning and other issues

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