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Test system and test method for dynamic bending fatigue property of thin film material

A fatigue performance testing, thin-film material technology, applied in vibration testing, machine/structural component testing, testing material strength using repetitive force/pulse force, etc. Inappropriate holding method and other problems, to achieve the effect of low cost, simple and fast sample clamping, and wide application frequency range

Inactive Publication Date: 2012-04-11
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, when the thickness of the film material is as small as the micron or even nanoscale, many mechanical property test systems and test methods suitable for conventional bulk materials can no longer meet the requirements of such small-scale material performance tests, such as insufficient load accuracy, test Improper sample clamping method, etc.
Scholars in related fields at home and abroad have tried to design and use various sophisticated experimental methods to test and evaluate the mechanical properties of various thin film materials, such as using a nano-indentation instrument to conduct dynamic bending experiments on cantilever beam samples. The method is complex, expensive, low test efficiency, and has special requirements for the tested film material system, so it cannot be widely used

Method used

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  • Test system and test method for dynamic bending fatigue property of thin film material
  • Test system and test method for dynamic bending fatigue property of thin film material
  • Test system and test method for dynamic bending fatigue property of thin film material

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Embodiment 1

[0033] The principle diagram of the test system of the present invention is as follows figure 1 shown.

[0034] Cu-Ta bilayer films with a total thickness of 1 μm and a single layer thickness of 500 nm were prepared on a polyimide substrate with a thickness of 125 μm by magnetron sputtering. Cut the sample into a rectangular sample of 12mm×2mm as the sample to be tested. First adjust the clamp on the base frame so that it is on the same level as the groove on the driving rod corresponding to the thickness of the sample, then fix one end of the sample on the clamp, and the other end of the sample snaps into the groove of the driving rod. The power supply generates an alternating current signal with a frequency of 100Hz and inputs it into the coil, thereby driving the driving rod to perform periodic reciprocating motion, and driving the free end of the sample to vibrate. The amplitude of the free end of the sample measured by the laser displacement sensor is 760 μm. Warp 8.64...

Embodiment 2

[0036] The rolled copper foil with a thickness of 180 μm was made into a rectangular sample of 8 mm×2 mm by wire cutting as the sample to be tested. Adjust the clamp on the base frame so that it is on the same level as the groove of the driving rod corresponding to the thickness of the sample, then fix one end of the sample with the clamp and snap the other end into the groove. The AC signal with a frequency of 50 Hz generated by the power supply is input to the coil, and the coil drives the driving rod to do periodic reciprocating motion in the magnetic field, thereby driving the free end of the sample to vibrate. Warp 2.57×10 6After cycles of fatigue loading, the specimen fractured. Scanning electron microscope observation shows that there is obvious fatigue extrusion on the surface of the sample, specifically as image 3 shown. The number of fatigue extruded strips per unit area decreases with increasing distance from the root of the cantilever beam. The angle between t...

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Abstract

The invention relates to a test system and a test method for the dynamic bending fatigue property of a small-scale thin film material. The test system comprises an electromagnetic driving part, a sample holding part and a measuring and observing part, and the system provides functions and a test method for dynamic bending fatigue property test for the thin film materials used for various micro / nanoelectronic mechanical systems and supported with matrix or without matrix, the metalized interlinking body foil material used for an integrated circuit and various two-dimensional thin plate type materials and can record in-situ real-time monitoring and analysis to the appearance of the tested sample. The free end of the cantilever beam sample is driven under the electromagnetic force of the electrified coil in the stationary magnetic field to reciprocate relatively to the equilibrium position thereof, thus various types of cyclic fatigue loads can be applied to various material samples, andthe precision of the applied fatigue loads can reach the millinewton magnitude. The invention can be used to evaluate the fatigue property and the fatigue crack growth behaviors of various thin film materials.

Description

technical field [0001] The invention relates to the establishment and testing method of a dynamic bending fatigue performance test system for small-scale thin-film materials, specifically thin-film materials and integrated circuits with or without substrate support for various micro / nano electromechanical systems (MEMS / NEMS) The metallized interconnect foil material and various two-dimensional thin plate materials are used to build a dynamic bending fatigue performance test system and to test and evaluate fatigue performance. Background technique [0002] With the further development of miniaturization of microelectronic devices, various single-layer or multi-layer thin-film materials with or without substrate support with micron or nanometer thickness are widely used in large-scale integrated circuit interconnection wiring, magnetic storage media and MEMS / NEMS devices and other fields. The thin-film materials used in these devices are often subjected to cyclical loads in ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/38
CPCG01M7/025G01M7/027
Inventor 张广平朱晓飞张滨
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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