Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Waterproof method for electronic device and waterproof electronic device

A technology for electronic devices and waterproof layers, which can be used in the secondary treatment of printed circuits, sealing shells, and coating non-metallic protective layers, etc., and can solve problems such as aging, damage to electronic devices, and wear on joint surfaces

Inactive Publication Date: 2009-11-18
QBAS CO LTD
View PDF0 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the above-mentioned waterproof gasket is usually made of rubber and other materials, which not only has the problem of aging, but also causes the mutual joint surfaces to be worn out when the waterproof shell is opened and closed too many times.
Moreover, moisture may still seep into the interior of the existing waterproof casing under extremely high water pressure, causing damage to electronic devices
Therefore, the existing waterproof housing cannot fundamentally and effectively solve the waterproof problem of electronic devices.
On the other hand, the use of a waterproof case will increase the overall weight, volume and additional cost of the electronic device, causing inconvenience in use and reducing the willingness of users to consume

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Waterproof method for electronic device and waterproof electronic device
  • Waterproof method for electronic device and waterproof electronic device
  • Waterproof method for electronic device and waterproof electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] Please refer to the waterproof electronic device 3 of the present invention Figure 3A and Figure 3B . It should be particularly noted here that, considering the convenience of operation of the waterproof electronic device 3 and the physical characteristics of the non-solid glue, the present invention uses two different properties of the first non-solid glue and the second non-solid glue to apply to the circuit. specific surface of the board, and form a first waterproof layer 27a and a second waterproof layer 27b with different characteristics. Secondly, for the convenience of description, various components covered by the first waterproof layer 27a and the second waterproof layer 27b are indicated by dotted lines in the drawings. Meanwhile, the second waterproof layer 27b also covers the periphery of the first waterproof layer 27a, so the periphery of the first waterproof layer 27a is also shown by dotted lines. The electronic device 3 of the present invention incl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a waterproof method for an electronic device and a waterproof electronic device. The electronic device comprises a circuit board; the circuit board comprises a board body, a plurality of conducting elements and a key device. The waterproof method comprises the following steps of: applying first non-solid glue to directly coat the key device, solidifying the first non-solid glue to form a first waterproof layer, applying second non-solid glue to at least directly coat the conducting elements, and solidifying the second non-solid glue to form a second waterproof layer. Finally, the circuit board, on which a plurality of waterproof layers are coated, is assembled in a casing body so as to form the waterproof electronic device.

Description

technical field [0001] The invention relates to a waterproof method, in particular to a waterproof method for electronic devices. Background technique [0002] With the improvement of living standards, modern people are increasingly demanding to maintain their health and improve their quality of life. When people are engaged in sports such as jogging and cycling, in order to avoid the monotony and boring caused by continuous repetitive actions or external environment, they often carry MP3 music players with them to increase the entertainment of the above-mentioned sports by listening to music. In recent years, among the numerous types of leisure activities, aquatic activities such as swimming and diving have become more and more popular, so the above-mentioned same idea has also been extended to swimming and diving and other underwater activities. However, the first problem to be overcome is to make these activities Such electronic devices can be used normally in water with...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/28H05K5/06
Inventor 薛恒正
Owner QBAS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products