Waterproof method for electronic device and waterproof electronic device
A technology for electronic devices and waterproof layers, which can be used in the secondary treatment of printed circuits, sealing shells, and coating non-metallic protective layers, etc., and can solve problems such as aging, damage to electronic devices, and wear on joint surfaces
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0027] Please refer to the waterproof electronic device 3 of the present invention Figure 3A and Figure 3B . It should be particularly noted here that, considering the convenience of operation of the waterproof electronic device 3 and the physical characteristics of the non-solid glue, the present invention uses two different properties of the first non-solid glue and the second non-solid glue to apply to the circuit. specific surface of the board, and form a first waterproof layer 27a and a second waterproof layer 27b with different characteristics. Secondly, for the convenience of description, various components covered by the first waterproof layer 27a and the second waterproof layer 27b are indicated by dotted lines in the drawings. Meanwhile, the second waterproof layer 27b also covers the periphery of the first waterproof layer 27a, so the periphery of the first waterproof layer 27a is also shown by dotted lines. The electronic device 3 of the present invention incl...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com