High-power semiconductor multi-tube high-performance positioning fixture
A technology for positioning fixtures and semiconductor tubes, which is applied to semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of large contact thermal resistance between semiconductor tubes, insulating materials and radiators, and low installation efficiency of production lines. To achieve the effect of increasing the size of the cabinet, improving productivity and reducing positioning time
Inactive Publication Date: 2011-06-22
SAMIL POWER
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Problems solved by technology
[0003] In view of the above defects, the object of the present invention is to provide a high-power semiconductor multi-tube high-efficiency positioning fixture with low cost, which can effectively improve productivity and effectively reduce contact thermal resistance, so as to solve the problem of high-power The traditional installation and fixing method of semiconductor tubes brings about the problems of low installation efficiency of the production line, excessive contact thermal resistance between semiconductor tubes, insulating materials and radiators
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[0015] Such as Figure 1-2 As shown, the high-power semiconductor multi-tube high-efficiency positioning fixture of the present invention includes a fixture body 13 made of elastic insulating material, and the two sides of the fixture body 13 are respectively connected to a PCB board 16 and a plurality of semiconductor tubes 15. The outer layer 3 of the fixture 13 is provided with two plastic columns 1 with a diameter of 1.9 and a draft angle of 1°. The two sides of the other side of the fixture body 13 are arc-shaped structures, and each arc surface 7 is provided with a A columnar buckle 5 with an outer diameter of Φ3.3 and an inner slot of 1.0, a nut insert 11 with a hole is provided at the center of the clamp body 13 .
[0016] Such as Figure 2-3 As shown, the high-power semiconductor multi-tube high-efficiency positioning fixture described in the present invention is matched and connected with the semiconductor tube 15 and the PCB board 16 respectively, including the two...
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The invention relates to a high-power semiconductor multi-tube high-performance positioning fixture, which comprises a fixture body made of elastic insulating materials, a fixture outer layer of the fixture body is provided with two plastic pillars, two sides positioned on the other surface of the fixture body are arc-shaped structures, a cylindrical buckle is respectively arranged on each arc surface, and a nut insert with a hole is arranged at the center of the fixture body. The introduction of the elastic insulating fixture can simultaneously position and fix the side direction and the normal direction of semiconductor tubes, and the characteristic of elastic deformation of the elastic insulating fixture can lead the semiconductor tubes and a heat sink to be effectively bonded and uniformly and tightly connected. The high-power semiconductor multi-tube high-performance positioning fixture greatly reduces the positioning time and reduces fault rate; additionally, the high-power semiconductor multi-tube high-performance positioning fixture can simultaneously position and fix a plurality of high-power semiconductor tubes, thereby effectively improving productivity; and the characteristic of elastic deformation of the product can ensure the effective bonding and the uniform and tight connection between the semiconductor tubes and the heat sink and effectively reduce thermal contact resistance.
Description
technical field [0001] The invention relates to a fixture for installing semiconductor tubes, in particular to a high-efficiency positioning fixture for multiple high-power semiconductor tubes. Background technique [0002] At present, the high-power semiconductor tubes commonly used in the electronics industry generally have 3 pins. When a variety of such high-power semiconductor tubes are used on the PCB board, due to too many pins and difficult positioning, it is difficult to operate when plugging in. The positioning is not accurate, and the reject rate is high. At present, the commonly used measures and solutions are mainly divided into three process steps. First, insert the pins of the semiconductor tube in production, and then use the Z-shaped or N-shaped sheet metal parts fixed on the heat sink to compress the high-power semiconductor tube. Finally, Go through the tin furnace again, and only one semiconductor tube can be positioned and compressed at most at a time; t...
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IPC IPC(8): H01L23/40H05K7/20
Inventor 郭伟牟英峰
Owner SAMIL POWER