Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electronic packaging method and device

An electronic and packaging technology, applied in circuits, electrical components, transportation and packaging, etc., can solve problems such as insurmountable substrate warpage and transmission problems in the size of the working area, limiting production capacity, etc.

Inactive Publication Date: 2010-01-13
POWERTECH TECHNOLOGY
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, packaging manufacturers use strip-shaped substrates to transfer to each process equipment for the packaging process in order to accommodate the specifications of the original process equipment, so they cannot overcome the problems of the size of the work area, substrate warpage and transfer, and thus limit the production capacity

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic packaging method and device
  • Electronic packaging method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0010] figure 1 Shown is a schematic flowchart of an electronic assembly method according to an embodiment of the present invention. In this embodiment, firstly, a substrate is loaded on the work platform ( S10 ). Wherein, the substrate can be a full version substrate (panel substrate). Next, a die attach procedure (die attach) is performed to fix a plurality of chips on the substrate (S20). Wherein, the die bonding process is to move a die bonding device, such as a glue dispensing device, a chip grabbing device, etc., to the work platform for operation. Afterwards, a wire bonding process (wire bond) is performed to electrically connect the chip to the substrate by using a plurality of wires ( S30 ). Wherein, the wire bonding procedure is to move a wire bonding device to the work platform for operation.

[0011] Next, a molding process (mold) is performed to cover the chip and the leads ( S40 ). Among them, the sealing procedure is to move the sealing device to the workin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an electronic packaging method and an electronic packaging device. The method carries out each packaging program by loading a work loading platform to a whole substrate. A plurality of packaging devices are hung near the work loading platform and are moved to an operation position by a mechanical arm. Therefore, problems of warping and transferring of the substrate can be effectively solved. The electronic packaging method and the electronic packaging device can use the whole substrate to carry out the packaging operation and can simultaneously carry out the same or different packaging programs in different areas of the whole substrate so as to effectively increase the yield and reduce the cost.

Description

technical field [0001] The invention relates to an electronic assembly method and its equipment, in particular to an electronic assembly method and its equipment that can use a full board. Background technique [0002] Generally speaking, substrate manufacturers use full panel substrates to manufacture packaging substrates, and before shipment, the full panel substrates are cut into strip type substrates and sent to packaging manufacturers for subsequent packaging operations. However, packaging manufacturers transfer strip substrates to various process equipment for packaging process in order to accommodate the specifications of the original process equipment, so they cannot overcome the size of the working area, substrate warpage and transmission problems, and thus limit the production capacity. Contents of the invention [0003] In order to solve the above problems, one of the objects of the present invention is to provide an electronic packaging method and its equipment...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/00H01L21/50H01L21/677
Inventor 方立志
Owner POWERTECH TECHNOLOGY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com