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32results about How to "Overcome warping" patented technology

Recombination wood and manufacturing method thereof

The invention provides a method for manufacturing reconstituted wood. Rotary cut is carried out on the raw wood for preparing a veneer or a veneer strip, defibering is carried out on the veneer, the forming points and/or wood bunch shades or wood bunches of striation crack are formed along the natural texture of wood on the veneer, then dipping, drying and hot pressing for molding the reconstituted wood are carried out. Compared with the prior art, the method of the invention solves the problem that wood bunch is irregular; the rate of utilizing wood and production efficiency of wood bunch are improved; defibering process is simplified and energy consumption for defibering is lowered. The process facilitates the cracks on the wood bunch shades and wood bunches to be very even and facilitates the dipping of wood bunch shades or wood bunches to be very even in the following dipping process; the product problems such as warp, deformation, jump fibre, and the like, are overcome, which are aroused by uneven defibering in making wood bunches from raw wood directly in the prior art, and the boards that the surface is very smooth, the mechanical performances such as stiffness and intensity, and the like, are higher than the raw material itself are made, therefore the fast-growing forest wood with worse performances and wider source can be made into the products of reconstituted wood which can compare beauty with noble hardwood.
Owner:INST OF WOOD INDUDTRY CHINESE ACAD OF FORESTRY

Method for processing blind buried hole on multilayer circuit board

The invention relates to a method for processing a blind buried hole on a multilayer circuit board, which belongs to the technical field of laser drilling. The technical key point of the invention comprises the following steps of: (1) confirming a position needing hole opening of the traditional mechanical blind buried hole circuit board; (2) processing a buried hole on an inner-layer plate of the position needing hole opening and electroplating again after filling resin into the buried hole for grinding to form a butting joint pad; and (3) drilling a laser blind hole on an upper-layer circuit board at at least one side of the processing buried hole and butting the laser blind hole with the pad formed electroplating on the mechanical buried hole to form a blind buried hole. Compared with the prior art, the invention has the advantages of shortening the process flow, thoroughly overcoming the phenomenon of board bending generated by asymmetric laminating structure design due to asymmetric hole layer distribution, solving the problem that a copper layer is relatively thicker and is adverse to the manufacture of a thin circuit because the traditional mechanical blind buried hole process outer layer is electroplated for many times, reducing the pressing frequency of board layers and the manufacture difficulty and improving the product quality.
Owner:BOMIN ELECTRONICS CO LTD +1

Integral dynamic rail weighbridge

The invention discloses an integral dynamic rail weighbridge, comprising a weighing body and a weighing bottom framework, wherein bottom ends of the weighing body are provided with a sensor respectively; the top surface of the weighing body is provided with two bearing rails which are arranged in parallel; joints between the bearing rail and a left approach rail and between the bearing rail and aright approach rail are connected with a transition device respectively; the top surfaces of the transition devices are consistent with those of the bearing rails, the left approach rail and the right approach rail; and one end of each transition device is arranged on one base of the approach rails, and the other end of each transition device extends to the weighing body. The integral structure is strong in matching performance, the sensors are used for detecting the weight, data channels and other advanced equipment are used for realizing transmission, treatment and other operations of data,electronic degree is high and operations are quick; the weighing bottom framework of the integral structure is configured and is integrally combined with a pit, the integral structure is simple and the bearing intensity is enough; a horizontal limited rod, a universal joint and other components in the weighing bottom framework performs self-limitation on four directions and eight positions of theweighing body directly, thus the integral design is reasonable; and the transition devices are configured, thus force points of wheels close to the inside of a weighing platform, thereby ensuring smooth transition and steady running.
Owner:YUYAO TONGYONG METER

PP film and solid wood board coating technology

The invention discloses a PP film and solid wood board coating technology. The PP film and solid wood board coating technology comprises the following steps that solid wood unit boards are prepared; moisture content is controlled; the moisture content of the prepared solid wood unit boards is controlled; an adhesive is applied to the solid wood unit boards, wherein the surfaces and peripheries ofthe solid wood unit boards are coated with the adhesive; PP film is prepared; the solid wood unit boards are coated with the with the PP film, wherein the solid wood unit boards coated with the adhesive are coated with the PP film, and sealing treatment is performed; assembly is performed, wherein the solid wood unit boards coated with the PP film are flatly laid between the two solid wood unit boards for assembly, one solid wood unit board coated with the PP film is laid between every two solid wood unit boards, the assembly layer number is N, and the number of the solid wood unit boards coated with the PP film is N-1; hot-pressing is performed, wherein hot-pressing is executed after assembly is completed; cold-pressing is performed, wherein boards are transferred into a cold-pressing machine within 2-3 minutes for cold-pressing after hot-pressing is completed. The PP film and solid wood board coating technology is somewhat improved based on solid wood boards, overcomes the shortcomings of possible arching, warping or deformation of the solid wood boards and has better stability.
Owner:绿新(无锡)装饰新材料有限公司

Method for processing blind buried hole on multilayer circuit board

The invention relates to a method for processing a blind buried hole on a multilayer circuit board, which belongs to the technical field of laser drilling. The technical key point of the invention comprises the following steps of: (1) confirming a position needing hole opening of the traditional mechanical blind buried hole circuit board; (2) processing a buried hole on an inner-layer plate of the position needing hole opening and electroplating again after filling resin into the buried hole for grinding to form a butting joint pad; and (3) drilling a laser blind hole on an upper-layer circuit board at at least one side of the processing buried hole and butting the laser blind hole with the pad formed electroplating on the mechanical buried hole to form a blind buried hole. Compared with the prior art, the invention has the advantages of shortening the process flow, thoroughly overcoming the phenomenon of board bending generated by asymmetric laminating structure design due to asymmetric hole layer distribution, solving the problem that a copper layer is relatively thicker and is adverse to the manufacture of a thin circuit because the traditional mechanical blind buried hole process outer layer is electroplated for many times, reducing the pressing frequency of board layers and the manufacture difficulty and improving the product quality.
Owner:BOMIN ELECTRONICS CO LTD +1

Integral dynamic rail weighbridge

The invention discloses an integral dynamic rail weighbridge, comprising a weighing body and a weighing bottom framework, wherein bottom ends of the weighing body are provided with a sensor respectively; the top surface of the weighing body is provided with two bearing rails which are arranged in parallel; joints between the bearing rail and a left approach rail and between the bearing rail and a right approach rail are connected with a transition device respectively; the top surfaces of the transition devices are consistent with those of the bearing rails, the left approach rail and the right approach rail; and one end of each transition device is arranged on one base of the approach rails, and the other end of each transition device extends to the weighing body. The integral structure is strong in matching performance, the sensors are used for detecting the weight, data channels and other advanced equipment are used for realizing transmission, treatment and other operations of data, electronic degree is high and operations are quick; the weighing bottom framework of the integral structure is configured and is integrally combined with a pit, the integral structure is simple and the bearing intensity is enough; a horizontal limited rod, a universal joint and other components in the weighing bottom framework performs self-limitation on four directions and eight positions of the weighing body directly, thus the integral design is reasonable; and the transition devices are configured, thus force points of wheels close to the inside of a weighing platform, thereby ensuring smooth transition and steady running.
Owner:YUYAO TONGYONG METER

Preparation method of NiFeBMo-based opening and closing locker multilayer composite structure material

The invention discloses a preparation method of a NiFeBMo-based opening and closing locker multilayer composite structure material. The NiFeBMo-based opening and closing locker multilayer composite structure material is prepared from NiFeBMo matrix alloy, an anti-wear agent, a heat conduction agent, a reinforcing agent and a curing agent as raw materials through the steps of structural design andcomponent calculation of all layers, matching preparation, vibration mixing, dry hot-press molding, curing heat treatment, overlaying sintering and machining of all layers. The NiFeBMo-based opening and closing locker multilayer composite structure material has the advantages that all layers are different in component and thickness, and the component difference is large; the material shows the gradient distribution trend, the relative use amount of the material is reduced, and the friction and wear performance of the material is remarkably enhanced. Meanwhile, the preparation method is simple,the preparation technology is easy to control, efficiency is high, technological parameters are stable, operation is easy to control, all layers of structures of a prepared opening and closing lockercan be freely divided and repaired, the mechanical performance is stable, and the service life is long.
Owner:XINXIANG UNIV

Method for stabilizing PI substrate to prevent warping and manufacturing method of display panel

The invention discloses a method for stabilizing a PI substrate to prevent warping and a manufacturing method of a display panel. The method for stabilizing the PI substrate to prevent warping comprises the steps of forming an amphiphilic material layer on the substrate; forming a PI layer on the amphiphilic material layer, wherein the amphiphilic material layer is at least located below the edgepart of the PI layer, and the curing temperature of the PI layer is higher than the critical dissolution temperature of the amphiphilic material layer. According to the scheme, due to the fact that the amphiphilic material layer is formed between the substrate and the PI layer, when the PI layer is heated to be solidified, and along with the temperature rise, the temperature is higher than the critical dissolution temperature of the amphiphilic material layer, an amphiphilic material in the amphiphilic material layer is lyophobic, so that the edge of the PI layer is contracted on the lyophobicamphiphilic material layer; a certain slip amount can be generated between the contracted part of the PI layer and the substrate, so that the problem that the contracted part of the PI layer pulls the substrate to be warped due to the existence of an adhesion force of the bonding strength between the PI layer and the substrate is solved; and under the condition that the substrate is not warped, the manufacturing precision of subsequent process devices can be ensured, and the damage to film forming equipment is avoided.
Owner:BOE TECH GRP CO LTD

A kind of preparation method of multi-layer composite structure material of nifebmo-based opening and closing locker

The invention discloses a method for preparing a multilayer composite structure material of a NiFeBMo-based opening and closing locker. Using NiFeBMo matrix alloy, anti-wear agent, heat conduction agent, reinforcing agent and curing agent as raw materials, the raw material powder of each layer is passed through each layer Structural design and composition calculation, proportioning preparation, vibration mixing, dry hot pressing, curing heat treatment, superimposed sintering and each layer of machining process are made of NiFeBMo-based multilayer composite structure material for opening and closing locker, which has various The layer has the advantages of different composition, different thickness, and large component difference, and presents a gradient distribution trend, which not only saves the relative amount of materials, but also significantly enhances its friction and wear properties. At the same time, the preparation method of the present invention is simple, the preparation process is easy to control, the efficiency is high, the process parameters are stable, the operation is easy to control, and the structure of each layer of the obtained opening and closing locker can be freely divided and repaired, the mechanical performance is stable, and the service life is long.
Owner:XINXIANG UNIV

A temperature-stable heterogeneous multilayer dielectric ceramic capacitor and its preparation method

InactiveCN103208365BEasy to meet the requirements of X7ROvercome warpingFixed capacitor dielectricStacked capacitorsElectricityDopant
The invention provides temperature stable type heterogeneous laminated dielectric medium ceramic capacitors and a production method thereof. The production method comprises enabling barium strontium titanate to be main materials and the general formula to be as follows; adding modified dopant and combustion-supporting materials and dividing into three different main mediums, namely A, B and C, according to different proportions; performing lamination according to combination modes such as AC, ABC, ACA, CAC and ACBCA and laminating in an accumulating or mixing mode under the condition that the thickness of every layer is controlled to be small enough; and pressing, sintering and shearing electrodes to achieve the production of series and parallel heterogeneous laminated dielectric medium ceramic capacitors. Although the temperature stable type heterogeneous laminated dielectric medium ceramic capacitors are formed by the barium strontium titanate, lamination of multilayer with different proportions and different thicknesses is utilized and every layer is corresponding to different dielectric constants, dielectric losses and Curie temperatures, so that the requirements of a capacitor X7R can be met due to adjustment of different thicknesses or layers. At the same time, the electrodes are directly and externally arranged with no inner electrode, so that mismatching of sintering characteristics of an electrode layer and a dielectric layer is effectively overcome and the problems such as ceramic body layering and warping after co-firing caused by the mismatching are solved.
Owner:HUBEI UNIV

Film processing device and method

PendingCN113478794AImprove longitudinal heat shrinkageOvercome warpingThin membraneEngineering
The invention discloses a film processing device. The film processing device comprises a transverse pulling box and a transverse pulling unit, the transverse pulling unit comprises a transverse pulling pinch roll unit and a transverse pulling cutter unit which are arranged in the transverse pulling box, and the transverse pulling box comprises an N3 area, a first cooling area and a second cooling area which are sequentially arranged in the transverse pulling box in the traction direction of a film. The transverse pulling pinch roll unit comprises at least two sets of pinch roll groups. The at least two sets of pinch roll groups are separately arranged in the first cooling area and the second cooling area. Each set of pinch roller group is used for clamping the two sides of the film in the width direction. The transverse pulling cutter unit and the transverse pulling pinch roll unit are sequentially arranged in the traction direction of the film, and the transverse pulling cutter unit is arranged in the N3 area and used for cutting the edge of the film. The invention further discloses a film processing method, the film can be separated from the clamping of a chain clamp before entering the cooling areas, the longitudinal thermal shrinkage rate is improved, and the problem that the film is wrapped due to the fact that the film is beaten towards the middle under the action of no transverse tension is solved.
Owner:HEFEI LUCKY SCI & TECH IND

Horizontal rolling process and forming device for special-shaped ring piece

The invention relates to the field of ring piece machining equipment, in particular to a horizontal rolling process and forming device for a special-shaped ring piece. The horizontal rolling process comprises the following steps that a blank is heated to the forging temperature and subjected to punch forming; a formed ring piece blank is moved to a working platform to be fixed; two opposite grinding wheels and two opposite pressing wheels are used for rolling an obtained workpiece blank; and flashes and burrs are removed. The forming device comprises the grinding wheels pressed on the side edge of a ring piece to be formed, the pressing wheels pressed on the side edge of the other side of the ring piece to be formed and arranged opposite to the grinding wheels, an operation platform used for placing the ring piece to be formed and driving the ring piece to rotate, and a support arranged on the operation platform and rotationally connected with the grinding wheels. By means of the design scheme that the edge of the pressing wheel is rolled by the rolling wheel to be warped consistently, the edge warping problem of the ring piece is effectively solved, and the quality of a finally-formed product is effectively improved; the replacement frequency of the support or the grinding wheel or the pressing wheel is reduced through an adjustable installation frame, meanwhile, the time for adjusting the support is saved, and operation is easy.
Owner:常州和仕达机械装备制造有限公司
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