Method for stabilizing PI substrate to prevent warping and manufacturing method of display panel
A substrate and warping technology, which is applied in semiconductor/solid-state device manufacturing, electrical solid-state devices, and devices for coating liquid on the surface, etc. It can solve problems that affect the manufacturing accuracy of process devices, damage to film-forming equipment, and warping of substrates.
Active Publication Date: 2019-07-30
BOE TECH GRP CO LTD
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Problems solved by technology
[0003] In view of the above defects or deficiencies in the prior art, it is desired to provide a method for stabilizing the PI substrate to prevent warping and a method for manufacturing a display panel, so as to solve the problem of warping of the substrate in the prior art, which affects the manufacturing accuracy of subsequent process devices, And the problem of causing damage to the film forming equipment
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[0021] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for ease of description, only parts related to the invention are shown in the drawings.
[0022] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.
[0023] Such as figure 1 As shown, the method for stabilizing the PI substrate provided by the present invention to prevent warping comprises the following steps:
[0024] S1: forming an amphiphilic material layer on the substrate;
[0025] The substrate is, for example but not limited to, a glas...
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Abstract
The invention discloses a method for stabilizing a PI substrate to prevent warping and a manufacturing method of a display panel. The method for stabilizing the PI substrate to prevent warping comprises the steps of forming an amphiphilic material layer on the substrate; forming a PI layer on the amphiphilic material layer, wherein the amphiphilic material layer is at least located below the edgepart of the PI layer, and the curing temperature of the PI layer is higher than the critical dissolution temperature of the amphiphilic material layer. According to the scheme, due to the fact that the amphiphilic material layer is formed between the substrate and the PI layer, when the PI layer is heated to be solidified, and along with the temperature rise, the temperature is higher than the critical dissolution temperature of the amphiphilic material layer, an amphiphilic material in the amphiphilic material layer is lyophobic, so that the edge of the PI layer is contracted on the lyophobicamphiphilic material layer; a certain slip amount can be generated between the contracted part of the PI layer and the substrate, so that the problem that the contracted part of the PI layer pulls the substrate to be warped due to the existence of an adhesion force of the bonding strength between the PI layer and the substrate is solved; and under the condition that the substrate is not warped, the manufacturing precision of subsequent process devices can be ensured, and the damage to film forming equipment is avoided.
Description
technical field [0001] The present invention generally relates to the field of display technology, in particular to a method for stabilizing a PI substrate to prevent warping and a method for manufacturing a display panel. Background technique [0002] OLED (Organic Light-Emitting Diode; organic light-emitting diode) flexible substrate needs to apply PI (Polyimide; polyimide) glue on the substrate in the initial stage of the process, and then heat and cure the PI glue to form a PI layer. When the PI layer is formed, the PI layer will shrink, and the shrinkage force of the PI layer is greater than that of the substrate. The edge shrinkage of the PI layer will drive the substrate to shrink toward the middle, thus causing the edge of the substrate to warp. After this warpage is formed, it will It will affect the manufacturing accuracy of subsequent process devices, and will also cause damage to the film forming equipment. Contents of the invention [0003] In view of the abo...
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IPC IPC(8): H01L51/56H01L51/00
CPCH10K71/00H10K77/111H10K59/1201C08J7/043B05D7/542B05D2505/50H10K71/851
Inventor 胡春静
Owner BOE TECH GRP CO LTD
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