Adhesive for organic film of semiconductor components and its preparation method and application

A semiconductor and organic film technology, used in semiconductor devices, semiconductor/solid-state device parts, adhesives, etc., can solve problems such as adhesion failure, and achieve ideal adhesion, moderate hydrolysis rate, and high hydrolysis efficiency.

Active Publication Date: 2019-08-13
昆山艾森世华光电材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides an adhesive for organic film of semiconductor components, its preparation method and application, which are used to solve the problem of delamination of the coating layer on the surface of the substrate of the electronic element and other adhesive failures caused by the application of the adhesive question

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] 99.5 g of the solvent was mixed with 0.00018 g of deionized water, and the solvent was composed of 99.1 wt % of 1-methoxy-2-propanol, 0.4 wt % of 3-aminopropylsilatriol and 0.5 wt % of 2-methoxyl-1-propanol composition, then add catalyst 0.0002g, after mixing in a 200mL conical flask, add bis-[3-(triethoxysilyl)propyl]-tetrasulfide and bis -[3-(triethoxysilyl) propyl]-disulfide mixture 0.5g in total, bis-[3-(triethoxysilyl) propyl]-tetrasulfide and bis-[3-( In the mixture of triethoxysilyl)propyl]-disulfide, the two components each account for half, wherein, the bis-[3-(triethoxysilyl)propyl]-tetrasulfide and bis -[3-(triethoxysilyl)propyl]-disulfide mixture and the mass ratio of the solvent is 1:199, the deionized water and the bis-[3-(triethoxy The mol ratio of the mixture of base silicon) propyl group]-tetrasulfide and bis-[3-(triethoxysilyl) propyl group]-disulfide is 1:100, the catalyst and the bis-[3 The mass ratio of the mixture of -(triethoxysilyl)propyl]-tetr...

Embodiment 2

[0044] 99.5 g of the solvent was mixed with 0.0002 g of deionized water, and the solvent was composed of 99.2 wt % of 1-methoxy-2-propanol, 0.4 wt % of 3-aminopropylsilatriol and 0.4 wt % of 2-methoxy-1-propanol composition, then add catalyst 0.0002g, after mixing in the conical flask of 200mL, add two [3-(methyltriethoxysilyl) propyl group] amine 0.5g, Wherein, the ratio of the mass of the bis[3-(methyltriethoxysilyl)propyl]amine to the solvent is 1:199, and the deionized water and the bis[3-(methyl The mol ratio of triethoxysilane group) propyl group] amine is 1:100, and the ratio of the mass of described catalyst and described two [3-(methyl triethoxysilyl group) propyl group] amine is 0.04% .

[0045] Stir the above mixed solution at ambient temperature (23° C.) to carry out hydrolysis. Due to the low amount of water, the mixed solution will form a single-phase solution after fully hydrolyzed. After 10 minutes, a single-phase solution will be formed in the Erlenmeyer flas...

Embodiment 4

[0050] Adopt photolithographic adhesion test, evaluate the adhesive agent that is used for the organic film of semiconductor module described in embodiment 1-2 and comparative example 1, the steps are as follows:

[0051] 1) Clean and dry the surface of the 8-inch silicon wafer with isopropanol;

[0052] 2) The adhesive used for the organic film of semiconductor components described in Examples 1-3 of the present invention and Comparative Example 1 is coated on an 8-inch silicon wafer by spin coating, and the silicon wafer is placed in an oven Baking at a temperature of 90°C for 15 minutes, the adhesive used for the organic film of the semiconductor component forms a film layer with a thickness of 15.5um on the surface of the silicon wafer;

[0053] 3) Coating the organic substrate on the surface of the silicon wafer treated in step 2);

[0054] 4) Place the silicon wafer under the specified mask, irradiate it with a photolithography machine, and then develop it at 23° C. for 3...

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PUM

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Abstract

The invention discloses adhesive used for a semiconductor component organic film. The adhesive comprises polyalkoxysilane with a coupling function and solvent, polyalkoxysilane has a silicon hydroxyl group, and the solvent is composed of 1-methoxy-2-propyl alcohol, 3-aminopropyl silanetriol and 2-methoxy-1-propyl alcohol; according to the adhesive used for the semiconductor component organic film, polyalkoxysilane having the adhesion function is fully hydrolyzed, little low polymer is generated during hydrolysis, the adhesive is good in adhesion effect when used for adhering to an organic base material and an inorganic base material, and a coating layer on the surface of the inorganic base material is prevented from warping or falling; the adhesive is particularly suitable for small-size electronic components with intensive and complex surface graphs.

Description

technical field [0001] The invention relates to an adhesive used for an organic film of a semiconductor component, a preparation method and application thereof. Background technique [0002] In the electronic processing industry, organic materials such as polyisoprene and phenolic formaldehyde are commonly used to coat glass, metal surfaces and / or semiconductor surfaces such as silicon, gallium arsenide and silicon-germanium as barrier or passivation layers , because these organic materials do not contain groups that have affinity for the surface of the above-mentioned inorganic materials, they cannot be well combined with the surface of the above-mentioned inorganic materials. Therefore, the inorganic substrate is usually treated with a binder first surface, and then coat the organic substrate onto the surface of the inorganic substrate. [0003] The commonly used adhesives are formulated from coupling agents and organic solvents. Silane is a commonly used coupling agent i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/08C08G77/26C08G77/28H01L23/29
Inventor 鲍杰
Owner 昆山艾森世华光电材料有限公司
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