Coreless panel manufacturing component, coreless panel, and coreless panel manufacturing method

A coreless board and component technology, which is applied in multilayer circuit manufacturing, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as board damage, card board scrapping, warping, etc., to overcome warping and improve yield Effect

Active Publication Date: 2017-11-17
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of semiconductor packaging products in the direction of high performance, thinness and low cost, the coreless thin substrate technology has been born; because the coreless board is too thin, it will encounter serious warping problems, and it is easy to cause damage to the board during the production process. The problem of discarded pallets

Method used

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  • Coreless panel manufacturing component, coreless panel, and coreless panel manufacturing method
  • Coreless panel manufacturing component, coreless panel, and coreless panel manufacturing method
  • Coreless panel manufacturing component, coreless panel, and coreless panel manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042]

Embodiment 2

[0044]

Embodiment 3

[0046]

[0047] The warpage height refers to the height difference between the two ends of the coreless board; the warpage rate is the value of the height difference divided by the length of the board to represent the degree of warpage of the board.

[0048] The above examples all show that controlling the glass fiber thickness difference between the outer curing sheet and the inner curing sheet to be greater than 8 μm can effectively control the warpage rate below 1%, and the warpage height difference is not higher than 5mm. And the greater the difference in glass fiber thickness, the lower the warpage rate.

[0049] By adjusting and matching the glass fiber thickness and resin content of different layers of prepreg asymmetrically, the warpage reduction of the coreless board can be realized simply and at low cost.

[0050] In addition, a double-layer glass fiber structure can also be arranged inside the outer curing sheet. The double-layer glass fiber structure includes a...

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PUM

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Abstract

Provided is a coreless plate fabricating member, comprising a supporting carrier and coreless plates disposed on both sides of the supporting carrier. The coreless plate comprises inner prepregs, outer prepregs, inner layer copper foils and outer layer copper foils; wherein the inner prepregs are disposed on both sides of the inner layer copper foils, the outer prepregs are disposed at the outermost layer of the inner layer copper foils, and the outer layer copper foils are provided at the outer prepregs; and gaps are opened on the frame of the inner layer copper foils. By using the coreless plate fabricating member, coreless plate and method for fabricating the coreless plate of the present application, the supporting carrier is ingeniously disposed, which can effectively overcome a problem of coreless plate warping, and improves the yield of the coreless plate production.

Description

technical field [0001] The invention relates to the field of coreless board technology, in particular to a coreless board manufacturing component, a coreless board and a coreless board manufacturing method. Background technique [0002] With the development of semiconductor packaging products in the direction of high performance, thinness and low cost, the coreless thin substrate technology has been born; because the coreless board is too thin, it will encounter serious warping problems, and it is easy to cause damage to the board during the production process. The problem of discarded pallets. Contents of the invention [0003] Based on this, it is necessary to provide a coreless board manufacturing component for the warpage problem. In addition, it is also necessary to provide a coreless board and a manufacturing method of the coreless board. [0004] A coreless board manufacturing component, comprising: a support carrier, and coreless boards arranged on both sides of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K3/42H01L21/58
CPCH05K3/42H05K3/46
Inventor 张志强李志东谢添华
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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