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Core-less board manufacturing component, core-less board and manufacturing method for core-less board

A coreless board and component technology, which is applied in multi-layer circuit manufacturing, printed circuit manufacturing, semiconductor/solid-state device manufacturing, etc., can solve problems such as board damage, card board scrapping, warping, etc., to overcome warping and improve yield rate effect

Active Publication Date: 2015-04-22
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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AI Technical Summary

Problems solved by technology

[0002] With the development of semiconductor packaging products in the direction of high performance, thinness and low cost, the coreless thin substrate technology has been born; because the coreless board is too thin, it will encounter serious warping problems, and it is easy to cause damage to the board during the production process. The problem of discarded pallets

Method used

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  • Core-less board manufacturing component, core-less board and manufacturing method for core-less board
  • Core-less board manufacturing component, core-less board and manufacturing method for core-less board
  • Core-less board manufacturing component, core-less board and manufacturing method for core-less board

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042]

Embodiment 2

[0044]

Embodiment 3

[0046]

[0047] The warpage height refers to the height difference between the two ends of the coreless board; the warpage rate is the value of the height difference divided by the length of the board to represent the degree of warpage of the board.

[0048] The above examples all show that controlling the glass fiber thickness difference between the outer curing sheet and the inner curing sheet to be greater than 8 μm can effectively control the warpage rate below 1%, and the warpage height difference is not higher than 5mm. And the greater the difference in glass fiber thickness, the lower the warpage rate.

[0049] By asymmetrically adjusting and matching the glass fiber thickness and resin content of different layers of prepreg, the warpage reduction of the coreless board can be achieved simply and at low cost.

[0050] In addition, a double-layer glass fiber structure can also be arranged inside the outer curing sheet. The double-layer glass fiber structure includes a...

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Abstract

A core-less board manufacturing component comprises a supporting carrier and core-less boards arranged on the two sides of the supporting carrier. The core-less boards comprise inner prepregs, outer prepregs, inner copper foil layers and outer copper foil layers. The inner prepregs are arranged on the two sides of the inner copper foil layers. The outer prepregs are arranged on the outermost inner copper foil layers, and the outer coil foil layers are arranged on the outer prepregs. Gaps are formed in frames of the inner copper foil layers. According to the core-less board manufacturing component, the core-less board and a manufacturing method for the core-less board, the supporting carrier is arranged ingeniously, the warping problem of the core-less boards can be overcome effectively, and the yield of the core-less boards is improved.

Description

technical field [0001] The invention relates to the field of coreless board technology, in particular to a coreless board manufacturing component, a coreless board and a coreless board manufacturing method. Background technique [0002] With the development of semiconductor packaging products in the direction of high performance, thinness and low cost, the coreless thin substrate technology has been born; because the coreless board is too thin, it will encounter serious warping problems, and it is easy to cause damage to the board during the production process. The problem of discarded pallets. Contents of the invention [0003] Based on this, it is necessary to provide a coreless board manufacturing component for the warpage problem. In addition, it is also necessary to provide a coreless board and a manufacturing method of the coreless board. [0004] A coreless board manufacturing component, comprising: a support carrier, and coreless boards arranged on both sides of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/42H01L21/58
CPCH05K3/42H05K3/46H05K3/4602
Inventor 张志强李志东谢添华
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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