Manufacturing method of capillary structure of flat-sheet heat pipe

Abstract

The invention discloses a manufacturing method of a capillary structure of a flat-sheet heat pipe, comprising the following steps: providing a lower cover board which has a straight heat absorption part and two extension parts extending outwards from the two opposite ends of heat absorption part in a slant way; providing a quantity of metal power; providing a die, which is an inner pore chamber having the outline thereof similar to that of the lower cover board and an opening arranged downwards, and is provided with a first holding section corresponding to the heat absorption part of the lowercover board and a second holding section corresponding to the extension parts with the depth of the first holding section larger than that of the second holding section; filling the metal power intothe die; sintering the lower cover board at high temperature to cause the metal power in the die to be sintered into a continuous capillary structure attached on the upper surface of the lower cover board, wherein the capillary structure comprises a first capillary section attached on the heat absorption part of the lower cover board and a second capillary section attached on the extension parts with the first capillary section being thinner than the second capillary section.

Description

technical field [0001] The invention relates to a method for manufacturing a capillary structure of a flat heat pipe, in particular to a method for manufacturing a capillary structure with different cross-sectional shapes. Background technique [0002] At present, heat pipes are commonly used in the industry to solve the high-density heat dissipation problem of high-speed computers, such as heat pipes, loop heat pipes, and flat heat pipes (Vapor Chamber) and other products. [0003] The working principle of the flat heat pipe is the same as that of the traditional heat pipe. Because it has a larger heat conduction area than the traditional heat pipe, and meets the high practical value of "light, thin, short, and small", it is widely used in electronic products with large heat dissipation surfaces. superior. [0004] Such as figure 1 and figure 2 As shown, a general flat heat pipe has an upper cover plate 100 prepared by a stamping process, a lower cover plate 101 matched...

AI Technical Summary

Problems solved by technology

At this time, if the capillary structure 102 is too thick, the bubbles generated by the evaporation of the working liquid will form a vapor layer between the capillary structure 102 and the upper surface of the lower cover plate 101, thereby increasing the thermal resistance of the heat pipe, and causing the lower cover plate The temperature of 101 rises rapidly and causes the heat pipe to burn out

If the capillary structure 102 is too thin, the working liquid evaporates too fast and the condensed working liquid returns slowly, so that the capillary structure 102 is dried or even burned, thereby affecting the working performance of the heat pipe

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