A method for slotting the guide wheel of a multi-wire cutting machine
A technology of multi-wire cutting machine and slotting method, which is applied in the direction of fine working devices, stone processing equipment, manufacturing tools, etc., can solve the problem of large difference in the thickness of silicon wafers, etc., and achieve the effect of small error and increased production
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Embodiment 1
[0026] The first groove distance a is determined according to the thickness of the product silicon wafer, the wire diameter of the cutting gold steel wire and the particle size of silicon carbide. The particle size of silicon is 1500 mesh, and the first groove distance a of the solar silicon wafer guide wheel for cutting 6 o’clock is 340 μm; the reduction factor b is determined according to the length of the guide wheel. Generally, the length of the guide wheel is L≤300mm, and the reduction factor b is 10 μm, the groove number n is the nth groove, and the total number of grooves N is 880.
[0027] The first groove pitch is a=340μm; the second groove pitch is a-b*[1 / (N-1)]=340-10*(1 / 879)=339.99; the length of the guide wheel is 300mm, and the reduction factor b is 10μm , the 440th groove pitch is a-b*[(n-1) / (N-1)]=340-10*(439 / 879)=335 μm; the final groove pitch is 330 μm.
[0028] When slotting the guide wheel, make appropriate modifications and adjustments on the computer set...
Embodiment 2
[0030] According to the thickness of the product silicon wafer, the diameter of the cutting gold steel wire and the particle size of silicon carbide, etc., the first groove distance a of the guide wheel for cutting solar silicon wafers is currently 340 μm; the length of the guide wheel is L>300mm, L≤500mm The reduction factor b is 15 μm; the slot number n is the nth slot, and the total number of slots N is 1500 slots.
[0031] The first slot pitch is a=340 μm; the second slot pitch is a-b*[1 / (N-1)]=340-15*(1 / 1499)=339.99; the 751st slot pitch is a-b*[(n-1 ) / (N-1)]=340-15*(750 / 1499)=332.49; the final groove pitch is 325 μm.
[0032] The setting procedure of the computer of the machine tool is the same as that of Embodiment 1, and the effect of increasing production and reducing cost is achieved by adopting this embodiment, and the thickness of the cut product is more consistent and stable.
Embodiment 3
[0034] According to the thickness of the product silicon wafer, the diameter of the cutting gold steel wire and the particle size of silicon carbide, etc., the first groove distance a of the guide wheel for cutting solar silicon wafers is currently 340 μm; the length of the guide wheel is L>500mm, L≤800mm , the reduction factor is 20μm; the slot number n is the nth slot, and the total number of slots N is 2400 slots.
[0035] The first slot pitch a=340; the second slot pitch is a-b*[1 / (N-1)]=340-20*(1 / 2399)=339.99; the 1201st slot pitch is a-b*[(n-1) / (N-1)]=340-20*(1200 / 2399)=330 μm; the final groove pitch is 320 μm.
[0036] The setting procedure of the computer of the machine tool is the same as that of Embodiment 1, and the effect of increasing production and reducing cost is achieved by adopting this embodiment, and the product thickness is more consistent and the technical index is stable.
[0037] The invention is suitable for cutting silicon crystal rods, mainly for c...
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