Heat radiation device

Abstract

The invention relates to a heat radiation device which is used for the heat radiation of a plurality of additional cards of a computer. The heat radiation device comprises a base and a heat radiationfin group, wherein the base is in heat-conduction connection with the additional cards, the heat radiation fin group is arranged on a second pedestal, the base comprises a first pedestal and a secondpedestal, the first pedestal is positioned above the additional cards, the second pedestal is superposed on the first pedestal, the first pedestal is extended downwards and provided with a plurality of first heat conduction fins which are respectively stuck at one side of the additional cards, and the second pedestal is extended downwards and provided with a plurality of second heat conduction fins which penetrate through the first pedestal and are respectively stuck at the other side of the additional cards. The first heat conduction fins and the second heat conduction fins of the first pedestal and the second pedestal of the heat radiation device are tightly clamped and pressed at the two opposite sides of the additional cards, heat generated by the additional cards is transmitted to theheat radiation fin group in time by the base for emission, and the heat radiation fin group is not influenced by the restrictions of small self volume of the additional cards and narrow space at bothsides of the additional cards because the heat radiation fin group is positioned above the additional cards, thereby enhancing the heat radiation performance of the heat radiation device by increasing the heat radiation area greatly.

Description

technical field [0001] The invention relates to a cooling device, in particular to a cooling device for cooling electronic components. Background technique [0002] With the continuous development of the computer industry, the operating frequency and speed of electronic components continue to increase, and the heat generated is increasing. If it is not removed in time, the accumulated heat will cause the temperature to rise and affect the normal operation of the heating electronic components. [0003] With the improvement of computer performance, the capacity of chips on additional boards such as memory sticks and graphics cards is increasing day by day, the size is getting smaller and smaller, and the working speed is getting faster and faster. The heat generated in the process is also increasing. How to quickly replace these additional boards The chip heat on the card can be quickly and effectively dissipated, which has also become a problem that the industry needs to solv...

AI Technical Summary

Problems solved by technology

However, due to the relatively small volume of boards such as memory sticks, the size of the heat dissipation board, its heat dissipation area, and its heat dissipation capacity are greatly limited. With the continuous improvement of computer performance and continuous advancement of technology, boards The heat generated by heat-generating electronic components such as chips is increasing, while the volume of boards and cards tends to become smaller and smaller. Therefore, such traditional heat dissipation methods are increasingly unable to meet the needs of computing systems such as memory sticks and video cards. Cooling requirements for additional boards

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