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Method for cleaving brittle materials

A technology of brittle materials and direction of travel, applied in the field of splitting and cutting, can solve problems such as thin slice fracture

Inactive Publication Date: 2010-03-10
OWENS TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The body of the crystal remains fairly rigid, but the thin section cannot resist the same force, so the riving blade is turned sideways, breaking the thin section before achieving full cleaving

Method used

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  • Method for cleaving brittle materials
  • Method for cleaving brittle materials
  • Method for cleaving brittle materials

Examples

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Embodiment Construction

[0045] Various embodiments of the present invention are described below with reference to the accompanying drawings. It is to be noted that the drawings are not drawn to scale and parts having similar structures or functions are denoted by the same reference numerals throughout the drawings. It should also be noted that the text and figures are only intended to facilitate describing specific embodiments of the invention. They are not intended to be exhaustive or to limit the scope of the invention. Additionally, what is described in connection with a particular embodiment of the invention is not necessarily limited to that embodiment, but can be implemented in any other embodiment of the invention.

[0046] Apparatus 10 according to embodiments of the present invention may be used, for example, to cleave slices from a bar of brittle material (see figure 1 ). As used herein, brittle materials generally refer to materials that can withstand only a small amount of deformation ...

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Abstract

An apparatus for cleaving a section of a bar of brittle material is provided. The apparatus comprises a support adapted to hold the section of the bar in a position to be cleaved, a blade, an actuatorcoupled to the blade for driving the blade at least partially through the bar to create a cleaved portion of the bar, and a follower for engaging the end of the bar during cleaving. An method of cleaving a section of a bar of brittle material is also provided. The method comprises initiating a crack in the bar and driving a blade through the bar to remove a portion of the brittle material from the end of the bar. In one embodiment, the blades drives through the bar at a controlled speed.

Description

[0001] This application is a divisional application of an invention patent application with an international filing date of June 3, 2005, a national application number of 200580023276.0, and an invention title of "method and device for splitting and cutting brittle materials". technical field [0002] The present invention relates generally to cleaving, and more particularly to methods and apparatus for cleaving brittle materials into thin sections. Background technique [0003] Thin flat "wafers" of semiconductor or similar materials are useful for optoelectronic devices and other solid state electronic devices, as well as substrates for various systems such as microelectromechanical systems (MEMS). Currently, they are typically obtained by sawing ingots or cast billets of material and polishing the resulting flakes. The sawing method is waste-intensive and expensive. Such high costs limit the market for certain products, such as photovoltaic systems. Traditional techniqu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B28D7/04H01L21/02
Inventor G·欧文斯
Owner OWENS TECH INC