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LED device

A technology of LED device and LED base, which is applied in the field of lighting, can solve the problems of small connection area between insulating layer and LED lamp base, and influence on heat dissipation effect, and achieve the effects of increasing heat transfer efficiency, increasing contact area, and improving heat dissipation efficiency

Inactive Publication Date: 2010-06-02
霍健 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] During the specific implementation process, the inventors of the present invention found that the heat dissipation effect is affected due to the small connection area between the insulating layer and the base of the LED lamp, and the insulating layer is made of a material with low thermal conductivity

Method used

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Embodiment 2

[0021] Embodiment 2. This embodiment is further improved on the basis of the foregoing embodiments.

[0022] This embodiment also includes an LED 21 with a base, a thermal guiding layer 22 , an insulating layer 23 and a heat sink 24 .

[0023] The base 21 a of the LED 21 with a base is connected to the thermal guiding layer 22 , and the other side of the thermal guiding layer 22 is connected to the insulating layer 23 ; the insulating layer 23 is connected to the radiator 24 .

[0024] The area of ​​the side of the thermal guiding layer 22 connected to the insulating layer 23 is at least 10% larger than the area of ​​the side of the base 21 a connected to the thermal guiding layer 22 .

[0025] The difference from the above-mentioned embodiments is that there is no need to consider the insulation problem between the thermal guiding layer 22 and the base 21a, and any connection method with high thermal conductivity can be used between the thermal guiding layer 22 and the base 2...

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Abstract

The invention discloses an LED device which comprises an LED containing a base, a heat guide layer, an insulating layer and a radiator; wherein one side of the heat guide layer is connected with the LED base and the other side is connected with the insulating layer; the area of the side of the heat guide layer, connecting with the insulating layer, is at least 10 percent more than that of the side of the heat guide layer, connecting with the LED base; and the insulating layer is connected with the radiator. In the embodiment of the invention, by additionally arranging the heat guide layer between the LED base and the insulating layer and increasing the contact area between the heat guide layer and the insulating layer, heat transmission efficiency is enhanced and heat dissipation efficiency is improved.

Description

technical field [0001] The invention relates to the lighting field, in particular to an LED device. Background technique [0002] As high-power LEDs (light emitting diodes, light-emitting diodes) are continuously applied in various fields, the high heat generated by high-power LEDs in use will gradually lead to excessive temperature of the PN junction and fluorescent materials in the LED, causing light efficiency Attenuation greatly shortens the life of the LED lamp. Therefore, there must be a heat dissipation structure in a high-power LED device. In all aspects of heat dissipation of high-power LEDs, how to guide the heat inside the LEDs to the radiator while ensuring the electrical insulation required between multiple LEDs is a key issue. [0003] Such as figure 1 Shown is the high-power LED heat dissipation structure in the prior art. Wherein 11 is an LED lamp comprising a base, 12 is an insulating layer, and 13 is a radiator. The insulating layer 12 is located betwe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V19/00F21V29/00F21Y101/02F21V29/508F21V29/71
Inventor 张宏志霍健杨钢桥
Owner 霍健