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Non-cooling type ultrared micrometering kampometer

A thermal radiometer, non-refrigerated technology, used in electrical radiation detectors, optical radiation measurement, radiation pyrometry, etc., can solve the problems of difficult process, easy breakage or peeling of bridge deck, etc., to reduce the difficulty of the process , the effect of structural stability

Active Publication Date: 2011-05-25
北方广微科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] The invention aims to solve the technical problem that the bridge deck in the existing non-refrigerated infrared microbolometer is easy to break or demembrane, resulting in a difficult process

Method used

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  • Non-cooling type ultrared micrometering kampometer
  • Non-cooling type ultrared micrometering kampometer
  • Non-cooling type ultrared micrometering kampometer

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Embodiment Construction

[0039] Such as Figure 5 and Figure 6 As shown, the structure of the uncooled microbolometer of the present invention includes: a substrate substrate 10, a sheet bridge deck 20, and two Ls arranged on the opposite side of the bridge deck 20 and located in the same plane as the bridge deck 20. Shaped bridge arm 30. One side of the bridge arm 30 protrudes into the bridge deck 20 and is connected with it. The two overlap to realize electrical connection. The bridge surface 20 is suspended above the substrate 10 and is supported by two bridge arms 30 and two electrical connection posts 40 .

[0040] Substrate 10, typically a silicon wafer, contains integrated circuits for reading signals. The upper surface of the base substrate 10 is provided with a reflective layer 11 . A vacuum gap layer 50 is formed between the lower surface of the bridge deck 20 and the upper surface of the reflection layer 11 .

[0041] The bridge deck 20 includes three layers, which are an absorption l...

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Abstract

The invention provides a non-cooling type ultrared micrometering kampometer comprising a substrate base, a sheet bright surface and two L-shaped bridge arms arranged at the opposite sides of the bright surface. One end part of either bridge arm is electrically connected with the bright surface; the other end part is connected with the base by an electric connecting column; a vacuum gap layer is formed between the bright surface and the substrate base the upper surface of which is provided with a reflecting layer; the bright surface sequentially comprises an absorption layer, a heat-sensitive layer and a passivating layer from bottom to top; each bridge arm sequentially comprises a thermal resistance layer and a conductance layer from bottom to top; and the absorption layer and the passivating layer of the bright surface have the similar thickness of 2800-3200 so that crushing stress generated by the absorption layer and tensile stress generated by the passivating layer are easier to balance; and the structure of the bright surface is extremely stable to avoid warping, deforming, fracturing or demolding. The invention greatly lowers the process difficulty.

Description

technical field [0001] The invention relates to a non-cooling infrared micro-bolometer used in instruments such as a non-cooling thermal imager, and the targeted infrared radiation wavelength range is 8-14 μm. Background technique [0002] Any object radiates energy to its surroundings. Infrared radiation refers to electromagnetic radiation having a wavelength in the range of 0.7-1000 μm. In the electromagnetic radiation emitted by the human body and other objects with similar temperature in the environment, 38% of the energy is concentrated in the wavelength range of 8-14 μm, which is also commonly called thermal radiation. Detectors capable of detecting thermal radiation in this band are collectively referred to as infrared thermal radiation sensors. When a plurality of infrared thermal radiation sensors are arranged on a chip in an array, and the chip is placed on the focal plane of a lens that can focus on infrared thermal radiation, an infrared focal plane pyranometer...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01J5/00G01J5/20B81B7/02
Inventor 方辉郭俊雷述宇
Owner 北方广微科技有限公司
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