Wafer-supporting platform

A technology of wafer-bearing table and wafer, applied in the field of wafer-bearing table, can solve problems such as inapplicability, and achieve the effect of reducing the time for changing manipulators

Inactive Publication Date: 2010-06-09
SHENYANG KINGSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional wafer stage will directly contact the central area of ​​the wafer, so it becomes inapplicable in the new process, whi

Method used

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Embodiment Construction

[0017] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0018] Such as figure 1 As shown, the novel carrier of the present invention mainly includes: an annular platform 1, a vacuum chuck 2, a groove 3, a vacuum channel 4 and a body 5, etc., the top of the body 5 of the wafer carrier is provided with an annular platform 1, and the wafer is placed on the annular platform 1 On the top, in the processing of wafers, there is usually a non-patterned annular band at the edge of the wafer that allows contact, and the annular table 1 is in contact with the annular band at the edge of the wafer, and the contact area is slightly smaller than the accessible area provided by the wafer. Annular platform 1 has groove 3, and groove 3 can be arc groove, and offers relatively on annular platform 1, and offering of groove 3 can make things convenient for I shape manipulator to enter and take and send wafer. Vacuum chucks 2 (...

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Abstract

The invention relates to the field of semiconductor, in particular to a wafer-supporting platform. The wafer-supporting platform can be used when wafer edges can only contact the wafer-supporting platform according to process requirements during rotary processing in the semiconductor industry to ensure that the central graphic area of a wafer does not contact the wafer-supporting platform, thereby preventing damages to a processed graph caused by the problems of the wafer-supporting platform. The wafer-supporting platform is provided with an annular platform, vacuum sucking discs, a groove, vacuum channels and a body, wherein the top of the body is provided with the annular platform; the annular platform is provided with the groove which is convenient for an I-shaped mechanical hand to enter to fetch and deliver the wafer; the vacuum sucking discs are distributed on the upper surface of the annular platform; and the inside of the body is provided with the vacuum channels communicated with the vacuum sucking discs. The wafer-supporting platform only carries out vacuum adsorption on annular belts on wafer edges and does not contact the graphic areas of the wafers, thereby obtaining high reliability and stable wafer adsorption without causing excursion, wafer drop, and the like.

Description

Technical field [0001] The present invention relates to the field of semiconductors, specifically a wafer holder. In the semiconductor industry, the wafer holder used when rotary processing is required. When the process requires that only the edge of the wafer is allowed to contact the wafer holder, the wafer holder of the present invention can be used The wafer holder ensures that the graphic area in the center of the wafer is not in contact with the wafer holder to prevent damage to the processed graphics due to the wafer holder. Background technique [0002] With the development of semiconductor technology, some processes require that only a few millimeters of the edge can be contacted with the wafer stage during wafer processing, and only the contact area allowed by the edge can be contacted during wafer transportation and processing. The traditional wafer stage will directly contact the central area of ​​the wafer, so it becomes inapplicable in the new process, which re...

Claims

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Application Information

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IPC IPC(8): H01L21/683
Inventor 王冲
Owner SHENYANG KINGSEMI CO LTD
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