The invention relates to the field of semiconductor, in particular to a wafer-supporting platform. The wafer-supporting platform can be used when wafer edges can only contact the wafer-supporting platform according to process requirements during rotary processing in the semiconductor industry to ensure that the central graphic area of a wafer does not contact the wafer-supporting platform, thereby preventing damages to a processed graph caused by the problems of the wafer-supporting platform. The wafer-supporting platform is provided with an annular platform, vacuum sucking discs, a groove, vacuum channels and a body, wherein the top of the body is provided with the annular platform; the annular platform is provided with the groove which is convenient for an I-shaped mechanical hand to enter to fetch and deliver the wafer; the vacuum sucking discs are distributed on the upper surface of the annular platform; and the inside of the body is provided with the vacuum channels communicated with the vacuum sucking discs. The wafer-supporting platform only carries out vacuum adsorption on annular belts on wafer edges and does not contact the graphic areas of the wafers, thereby obtaining high reliability and stable wafer adsorption without causing excursion, wafer drop, and the like.